Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 59370-8100 |
Series: | 59370 - MicroTPA - MUO 2.5 |
Connector Type: | MicroTPA, MUO 2.5 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Phosphor Bronze |
Contact Plating: | Tin |
Circuit Application: | Signal |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | .889 µm |
Contact Termination Plating Thickness: | .914 µm |
Wire Size: | 22 AWG, 24 AWG, 26 AWG, 28 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Wire Insulation Diameter: | .9 - 1.5 mm |
Part Aliases: | 0593708100 |
SKU: | MOL59370-8100 |
59370-8100
Heilind Number: | MOL59370-8100 |
Manufacturer: | Molex |
Manufacturer Number: | 59370-8100 |
Datasheet: | Product Specification |
ECAD Model: |
Specifications
Detailed Description
Introducing the 59370-8100, a high-performance MicroTPA MUO 2.5 connector designed for reliable signal transmission. Featuring a female gender and compatibility with 24-28 AWG wires, this connector ensures a secure and efficient connection. Constructed with phosphor bronze contacts and tin plating, it offers superior conductivity and durability. The crimp or compression termination method allows for easy installation, while the .889 µm mating area plating thickness guarantees optimal performance. RoHS compliant and suitable for various applications, the 59370-8100 is a top choice for your connectivity needs.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
09/15/2016 | 501416 - Equipment Transfer, Production Transfer or Rearrangement. | Download |