55755-0419

Heilind Number:MOL55755-0419
Manufacturer:Molex
Manufacturer Number:55755-0419
Datasheet:3DDrawing
ECAD Model:
3D Model

Description:

2.00mm Pitch MicroTPA Wire-to-Board Header, Vertical, Shrouded, Kinked PC Tail, with Inner Positive Lock, 4 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 55755-0419
Color:Natural
Series:55755 - MicroTPA
Amperage:2.5 A
Connector Type:MicroTPA
Number of Contacts:4
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Straight
Pitch:2 mm
Voltage:250 V
Material:Nylon
Orientation:Vertical
Keying:No
Tail Length:3.3 mm
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:1.016 µm
Number of Contacts Loaded:4
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Contact Termination Plating Thickness:1.016 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Mated Height:13.45 mm
Stackable:No
Surface Mount Compatible:No
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Part Aliases:0557550419
SKU:MOL55755-0419

Detailed Description

Introducing the 55755-0419, a high-performance MicroTPA connector designed for seamless wire-to-board connections. This straight, natural-colored connector features a durable nylon body with brass contacts, ensuring reliable signal transmission in a wide range of applications. With 4 contacts and a 2.5A amperage rating, it offers robust power delivery, while its 2mm pitch and 250V voltage rating accommodate versatile use. Featuring through-hole termination and a vertical orientation, this connector is easy to install on standard 1.6mm PCBs. Each contact is tin-plated for enhanced conductivity, with a mating cycle of 30 ensuring long-term durability. Fully shrouded and RoHS compliant, the 55755-0419 guarantees both performance and environmental responsibility in your connectivity solutions.