| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171722-3002 |
| Gender: | Female |
| Housing Material: | Plastic |
| Number of Contacts: | 228 |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold |
| Pitch: | 0.8 mm |
| Data Rate: | 28 Gbps |
| Port Configuration: | 2x3 |
| Shielded: | Yes |
| Current Rating: | 0.5 A |
| Voltage Rating: | 30 V |
| Operating Temperature: | -40 to 85 °C |
| Mounting Angle: | Right Angle |
| Form Factor: | QSFP+ |
| SKU: | MOL171722-3002 |
171722-3002
| ICC Number: | MOL171722-3002 |
| Manufacturer: | Molex |
| Manufacturer Number: | 171722-3002 |
| Datasheet: | Datasheet |
| ECAD Model: | |
Description:
zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-3 Connector and Cage with Metal EMI Gasket, 228 Circuit, Gold (Au) Over Nickel Plated, Up/Down Light Pipe Indicators
More >>Specifications
Detailed Description
Introducing the Molex zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-3 Connector and Cage with EMI Spring Finger, a high-performance connectivity solution for your networking needs. This black-colored connector features 228 gold (Au) over nickel plated contacts, ensuring reliable signal transmission. With a low amperage of .5 A and a voltage rating of 30 V AC/DC, it offers efficient power delivery. The through-hole compliant pin termination method and copper alloy contact material guarantee secure and durable connections. Designed for versatility, this connector has 6 ports and a right-angle orientation. It is RoHS compliant and UL agency certified, meeting international safety and environmental standards. Trust the Molex zQSFP+ Connector for seamless high-speed data transfer in your applications.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 170382-0001 | zSFP+ Assembly, Right-Angle, Surface Mount, 20 Circuits, 0.38µm Gold (Au), Tin Tails |  |
 | Molex 170432-0002 | zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, Surface Mount, 38 Circuits, Gold (Au) Plated 0.762µm, Supports QSFP28 / EDR / QSFP56 | |
 | Molex 171971-0105 | 2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, 3.30mm Tail Length, 0.38µm Selective Gold (Au) Plating, Tube, 5 Circuits | |
 | Molex 203263-6785 | Sentrality 6.00mm Screw Mount Pin, 51.52mm Engagement Length | |
 | Molex 204318-0006 | Sentrality 6.00mm Top-entry, Surface Mount Socket Assembly | |
 | Molex 44432-0802 | Micro-Fit BMI Header, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.38µm Gold (Au) Plating, Kinked Tails | |
 | Molex 44764-0801 | Micro-Fit BMI Receptacle Header, Dual Row, Right-Angle, with Press-fit Plastic Pegs, 1.02µm Tin (Sn) Plating, Mylar Positioning Strip, 8 Circuits | |
 | Molex 53047-0310 | 1.25mm Pitch, PicoBlade PCB Header, Single Row, Vertical, Through Hole, Tin Plating, Friction Lock, 3 Circuits, 2.30mm PC Tail Length | |
 | Molex 70543-0004 | 2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 3.30mm Tail Length, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Matte Tin (Sn) Tail Plating | |
 | Molex 76170-1036 | Impact 100 Ohm 3 Pair Right-Angle Daughtercard Receptacle, Unguided, 6 Columns, 54 Circuits, Plated Through Hole Dimension 0.39mm, Lead-Free | |
 | Molex 76170-3036 | Impact 100 Ohm 3 Pair Right-Angle Daughtercard Receptacle, Left Guided, 6 Columns, 54 Circuits, Plated Through Hole Dimension 0.39mm, Lead-Free | |
 | Molex 78347-1004 | Impact 3 Pair, Right-Angle Power Header, Left Hold-Down, Press-Fit, Module 1: P1 & P2 Blade Length 5.70mm & 6.90mm, LCP, Glass Filled UL94-V0, Black Packaging, Lead-Free | |
 | Molex 78798-0001 | 1.27mm Signal Pitch, 0.80mm Signal Pitch, 1.27mm Power Pitch SAS-3/PCIe-3 Receptacle, Right-Angle, Surface Mount, with Forklock, 2.85mm Height, 3.50mm Peg Length, 1.60mm PCB Thickness, 68 Circuits, with Cap, Lead-Free | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/30/2026 | 518734 - Retraction of PCN 517380. Cancel previous issued PCN 517380 previous communication was made on molex Singapore is moving its sub module assembly operation from Singapore to its approved sub con located in Indonesia. | Download | |||
| 11/05/2026 | 517380 - Equipment/Production Transfer or Rearrangement. inform you about equipment transfer that have been used to manufacture impacted part(s). Equipment have been moved to different site/ location/ premises. No changes will be made to product as part of this change. | Download | |||
| 03/05/2022 | 511503 - Change Supplier. due to resin supply constraint molex shall add new source of resin used at ZQSFQ and ZSFP product family series with new supplier wote. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 05/31/2021 | 510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints. | Download | |||
| 10/29/2020 | 509555 - Retraction of Obsolete status. Molex has revised the decision to obsolete selected part numbers as previously announced | Download | |||
| 04/29/2016 | 500741 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download | |||
| 01/01/2016 | GCM 10730795 - New, Modified, Or Replacement Tooling. Molex is buildling 2 new molds for better production capacity of the Lightpipe and housing component used in zQSFP+ connector. The gating point of the housing new mold will be different from the current mold as shown. Both new molds will be used in production at Molex Singapore Plant. This change will not affect Form, Fit, or Function of the product. The new molds will be internally qualified before using for mass production. Products made in or after Jan 16 will contain components from the new mold. | Download | |||
| 12/01/2015 | GCM 10724605 - Supplier Changes To Raw Material. This letter is to informed you that there is a change in manufacturing location from Malaysia to China for plastic resin used in the products listed in the attachment initiated by the plastic resin maker. There is no impact to the product form, fit and function as the raw plastic resin material composition remains unchanged. Brand name is changed as well from Vectra to LAPEROS. | Download | |||
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Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |