| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 170432-0002 |
| Color: | Black |
| Series: | 170432 - zQSFP Plus - zQSFP |
| Amperage: | .5 A |
| Connector Type: | zQSFP Plus |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .762 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 38 |
| Mating Cycles: | 50 |
| PCB Retention: | Yes |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Board to Board, Module to Board, Wire to Board |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1704320002 |
| SKU: | MOL170432-0002 |
170432-0002
Specifications
Detailed Description
The zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, SKU 170432-0002, is a high-performance connector designed for demanding applications. Featuring 38 circuits and gold (Au) plated 0.762μm contacts, this black connector is engineered to support QSFP28/EDR interfaces. With a low amperage rating of 0.5A and a voltage capacity of 30V AC/DC, it ensures reliable power delivery. The surface mount termination method and copper alloy contact material guarantee secure and efficient connections. With a compact right-angle orientation and embossed tape packaging for convenience, this connector is ideal for high-speed cage and module applications. RoHS compliant and UL certified, it meets stringent quality and safety standards, making it the perfect choice for your connectivity needs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 170382-0001 | zSFP+ Assembly, Right-Angle, Surface Mount, 20 Circuits, 0.38µm Gold (Au), Tin Tails |  |
 | Molex 171224-2011 | zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-2 with 4 Light Pipes, 80 Circuits | |
 | Molex 171722-3002 | zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-3 Connector and Cage with Metal EMI Gasket, 228 Circuit, Gold (Au) Over Nickel Plated, Up/Down Light Pipe Indicators | |
 | Molex 171971-0105 | 2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, 3.30mm Tail Length, 0.38µm Selective Gold (Au) Plating, 5 Circuits | |
 | Molex 172185-0002 | EXTreme EnergetiC Modular Right-Angle Plug Assembly, 29 Circuits (25 Signal/4 Power) with Solder Tail Mounting, with Guide | |
 | Molex 204066-1124 | Impel Plus 90 Ohm, 4-Pair Right-Angle Daughtercard, 1.90mm Pitch, Unguided, 14 Columns, 112 Circuits, Plated Through Hole Dimension 0.31mm | |
 | Molex 204318-0006 | Sentrality 6.00mm Top-entry, Surface Mount Socket Assembly, Tray | |
 | Molex 44432-0802 | Micro-Fit BMI Header, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.38µm Gold (Au) Plating, Kinked Tails | |
 | Molex 503763-0291 | 1.00mm Pitch, Pico-Lock PCB Header, Single Row, Right-Angle, Surface Mount, Gold over Nickel Plating, Positive Lock, 2 Circuits, Tape and Reel | |
 | Molex 70543-0004 | 2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 3.30mm Tail Length, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Matte Tin (Sn) Tail Plating | |
 | Molex 78347-1004 | Impact 3 Pair, Right-Angle Power Header, Left Hold-Down, Press-Fit, Module 1: P1 & P2 Blade Length 5.70mm & 6.90mm, LCP, Glass Filled UL94-V0, Black, Tray Packaging, Lead-Free | |
 | Molex 78798-0001 | 1.27mm Signal Pitch, 0.80mm Signal Pitch, 1.27mm Power Pitch SAS-3/PCIe-3 Receptacle, Right-Angle, Surface Mount, with Forklock, 2.85mm Height, 3.50mm Peg Length, 1.60mm PCB Thickness, 68 Circuits, with Cap, Tape and Reel, Lead-Free | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/12/2026 | 517735 - Packaging Method/Quantity Changing. products will undergo changes for packaging specification change. No changes will be made to product as part of this change. | Download | |||
| 01/31/2024 | 514009 - Packaging Method/Quantity Changing. This notification is to inform you about the following changes that are being made to the packaging of ZQSFP+ SMT Connector . Change: To standardize the packaging for ZQSFP+ connectors, we are moving away from using the corner guides and white bubble form & switching to pink bubble form. | Download | |||
| 10/31/2021 | 510998 - Change Supplier. 2021 has caused a global shortage for various grades of resin. this extraordinary event in conjunction with an already constrained market has cause immediate and severe disruption in the industry due to these supply constraints of LCP marketing molex identified an internal shortage of resin supply which would create a challenege to fulfill all orders therefore an alternative resin has been identified. | Download | |||
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
| 05/31/2021 | 510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints. | Download | |||
| 06/14/2019 | 506859 - Capacity change or tool replacement. Another set of tooling is being added to meet the current and future demands of this product. | Download | |||
| 08/22/2018 | 502865 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download | |||
| 06/15/2016 | GCM 10738433 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the assembly method from manually to automatically, this change is to improve the quality performance. We thank you for choose Molex products, you can contact the local sales if any requirement. | Download | |||
Availability
In Stock:
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Stock Location:
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Factory Stock:
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Factory Lead:
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Unit Of Measure:
Each
Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 170432-0002 |
| Other Names: | 1704320002 |