170382-0001

zSFP+ Assembly, Right-Angle, Surface Mount, 20 Circuits, 0.38?m Gold (Au), Tin Tails

Part Aliases: Molex 1703820001  
The Molex zSFP+ Assembly, a high-speed I/O connector designed for reliable performance in demanding applications. This female connector features a right-angle, surface mount design with 20 circuits for efficient connectivity. Constructed with brass and phosphor bronze contacts plated in gold, it ensures optimal signal transmission. The tin tail termination method and thermoplastic housing with a 0.8mm pitch offer durability in harsh environments. With a low amperage rating of 0.5A and a voltage tolerance of 30V AC/DC, this connector is suitable for various power and signal applications. RoHS compliant and lead-free reflow capable, it meets environmental standards. Trust the Molex zSFP+ Assembly for secure and high-speed connectivity in your designs.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
Invalid quantity value
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 170382-0001
Color:Black
Series:170382 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Brass, Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:8 mm
Voltage:30 V AC/DC
Material:Thermoplastic
Orientation:Right Angle
Keying:No
Component Type:I/O Plug Connector Subassembly
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Ground to Panel / PCB:No
Number of Contacts Loaded:20
Mating Cycles:100
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.381 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.57 mm
Supplier Product Group:High Speed Cage & Connector Assemblies
Connector System:Module to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):015
Max. Cycles at Max. Process Temperature:003
Termination Pitch:.8 mm
Electrical Model:Yes
Lock to Mating Part:No
Surface Mount Compatible:Yes
Waterproof Dustproof:No
Material Flammability Standard:94V-0
Part Aliases:1703820001
SKU:MOL170382-0001

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
12/30/2023513862 - Packaging Method/Quantity Changing. In order to internal process improve & improve quality, change the SPQ/box is from 960pcs to 1920pcs.
Download
11/27/2022512025 - Change To Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Molex has identified a shortage risk of resin supply which would create a challenge to fulfill orders therefore a new LCP resin has been identified for relative product.Download
07/01/2020508674 - Capacity change or tool replacement. Molex Chengdu will be adding the ZSFP PLASTIC HOUSING 20KT capacity mold to support increasing demand.Download
02/17/2020508159 - Production Location Change. Molex Chengdu will add local qualified vendor as stamping source, then will ve able to run terminal production in both locations of Molex Chengdu & local qualified stamping vendor. No impact to fit, form or function.Download
07/04/2019506624 - Capacity change or tool replacement. another set of tooling is being added to meet the current and future demands of this product.
Download
05/26/2019505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change.Download
12/16/2018506163 - Manufacturing Process Change. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change.Download
07/26/2018502820 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move.Download
04/30/2015GCM 10657723 - Product Component Change.Download
08/03/2014GCM 10640994 - New, Modified, Or Replacement Tooling. The purpose of the change is new stamping die build from 1rowx1up to 2rowx1up and the reason of change is for supporting customer increasing monthly demand and mitigate constraint of press machine. No form, fit, function impacted on products.Download