43860-0001
Modular Jack, Right Angle, Low Profile, Inverted, 8/8
Part Aliases: Molex 0438600001
The 43860-0001, a high-performance Modular Jack designed for seamless connectivity in electronic devices. This Right Angle, Low Profile, Inverted jack features 8/8 configuration, ensuring reliable data transmission. With a sleek Black finish, it adds a touch of sophistication to any application. Crafted from durable High Temperature Thermoplastic and boasting Gold-plated Phosphor Bronze contacts, this RJ45 connector guarantees longevity and signal integrity. Suitable for Through Hole termination, it offers easy installation on PCBs with 1.6mm thickness. Certified for CSA and UL standards, this lead-free connector is RoHS compliant, making it a safe and environmentally friendly choice for your projects. Whether you're a professional in the field or a DIY enthusiast, the 43860-0001 is the perfect solution for all your networking needs. Upgrade your systems today and experience seamless connectivity like never before.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43860-0001 |
| Color: | Black |
| Series: | 43860 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 150 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Mating Cycles: | 500 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.02 mm |
| Surface Mount Compatible: | No |
| Waterproof Dustproof: | No |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0438600001 |
| SKU: | MOL43860-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download |
| 06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Download |