43650-0319

Heilind Number:	MOL43650-0319
Manufacturer:	Molex
Manufacturer Number:	43650-0319
Datasheet:	Packaging Specifications
ECAD Model:

Description:

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 3 Circuits, with PCB Press-fit Metal Retention Clip, Gold, Glow-Wire Capable, Black

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Specifications

Attribute	Value
Product Category:	PC Board Pin & Receptacle Connectors PCB Pin Headers
Manufacturer:	Molex
Manufacturer Part Number:	Molex 43650-0319
Color:	Black
Series:	43650
Amperage:	8.5 A
Connector Type:	Micro-Fit 3.0
Number of Contacts:	3
Number of Rows:	1
Termination Method:	Through Hole - Kinked Pin
Contact Material:	Brass
Body Orientation:	Straight
Pitch:	3 mm
Voltage:	600 V
Material:	High Temperature Thermoplastic
Orientation:	Vertical
Operating Temperature Range:	-40 - 105 °C
Contact Mating Area Plating:	Gold
Contact Mating Area Plating Thickness:	.381 µm
Number of Contacts Loaded:	3
Mating Cycles:	30
PCB Locator:	Yes
PCB Retention:	Yes
Polarized to PCB:	Yes
Contact Termination Plating Thickness:	2.540 µm
PCB Thickness (Recommended):	1.6 mm
Connector System:	Wire to Board
Contact Termination Plating:	Tin
Maximum Solder Process Temperature:	260 °C
Lead Free Process Capability:	SMC and Wave
Duration at Max. Process Temperature (seconds):	030
Max. Cycles at Max. Process Temperature:	003
Glow Wire Capable:	Yes
Mated Height:	17.27 mm
Stackable:	No
Surface Mount Compatible:	Yes
Breakaway:	No
Shroud Type:	Fully
Product Name:	Micro-Fit 3.0
Material Flammability Standard:	94V-0
Part Aliases:	0436500319
SKU:	MOL43650-0319

Detailed Description

Introducing the Micro-Fit 3.0 Vertical Header, a high-performance connectivity solution for your PCB applications. Featuring a sleek black design with a 3.00mm pitch, this single-row header is equipped with 3 circuits for efficient power and signal transmission. The included PCB press-fit metal retention clip ensures secure and reliable installation, while the gold contact mating area plating (0.381µm thick) guarantees excellent conductivity. With a current rating of 8.5A and a voltage of 600V, this header is perfect for demanding environments. Its straight body orientation and through-hole kinked pin termination method offer easy integration, while its high-temperature thermoplastic construction ensures durability. RoHS compliant and lead-free process capable, the Micro-Fit 3.0 header is a reliable choice for your wire-to-board and wire-to-wire connections.

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Product Change Notice

Effective Date	Description of Change	Download
11/22/2024	515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales.	Download
06/07/2024	514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable.	Download
08/01/2021	510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system.	Download
06/01/2021	510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.	Download
07/01/2017	502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download