22-04-1021

ICC Number:	MOL22-04-1021
Manufacturer:	Molex
Manufacturer Number:	22-04-1021
Datasheet:	Datasheet
ECAD Model:

Description:

Mini-Latch / KK Wire-to-Board Header, Vertical, with Friction Ramp, 2 Circuits, Tin (Sn) Plating, Natural

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Specifications

Attribute	Value
Product Category:	PCB Connectors PCB Headers & Receptacles
Manufacturer:	Molex
Manufacturer Part Number:	Molex 22-04-1021
Gender:	Male
Number of Contacts:	2
Number of Rows:	1
Contact Material:	Brass
Contact Plating:	Tin
Pitch:	2.5 mm
Shrouded:	Yes
Flammability Rating:	UL 94V-0
Current Rating:	3 A
Voltage Rating:	250 V
Operating Temperature:	-40 to 105 °C
Mounting Angle:	Straight
Mounting Type:	Through Hole
PCB Connector Type:	PCB Mount Header
SKU:	MOL22-04-1021

Detailed Description

Introducing the 22-04-1021 Mini-Latch Wire-to-Board Header, a vertical connector designed for secure and efficient board-to-wire connections. With a friction ramp for added stability, this two-circuit header features tin plating for enhanced conductivity and durability. Its compact design, featuring natural coloring and a straight body orientation, makes it ideal for space-restricted applications. Constructed from high-quality polyamide and brass with a 2.5mm pitch, this connector is rated for 3A and 250V, ensuring reliable performance. RoHS compliant and with a wide operating temperature range, this header is suitable for various industries, including telecommunications, automotive, and consumer electronics. Upgrade your connectivity solution with the 22-04-1021 Mini-Latch Wire-to-Board Header.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 22-03-2041	KK 254 Wire-to-Board Header, Single Row, Vertical, 4 Circuits, PA Polyamide Nylon, Tin (Sn) Plating
	Molex 39-28-1043	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 4 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 43650-0215	Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 2 Circuits, with PCB Polarizing Peg, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black
	Molex 43650-0419	Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 4 Circuits, with PCB Press-fit Metal Retention Clip, 0.38µm Gold Plating, Glow-Wire Capable, Black
	Molex 54819-0519	Mini USB, B-Receptacle, Right-Angle, Through Hole Solder Tails and Shell Tabs, Lead-Free
	Molex 55932-0230	MicroClasp Vertical Header, 2.00mm Pitch, Single Row, Through Hole, Tin (Sn) Plating, 2 Circuits, without PCB Locator
	Molex 55932-0510	MicroClasp Vertical Header, 2.00mm Pitch, Single Row, Through Hole, Tin (Sn) Plating, 5 Circuits, with PCB Locator
	Molex 73251-2201	SMA Jack, Right-Angle, Bulkhead Receptacle, PCB, Through Hole, Brass Body, Gold (Au) Plated, Jam Nut and Lockwasher Included, 2.79mm Leg Length, 50 Pieces Per Tray, 50 Ohms
	Molex 90059-0009	2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.381Âµm Select Gold (Au) with Gold (Au) Flash Plating

Product Change Notice

Effective Date	Description of Change	Download
05/16/2024	514531 - Change Supplier. This notification is to inform you about Supplier product location transferred from Japan vendor(Supplier) to Korea vendor impacting the part(s) as per attached list. No changes will be made to product as part of this change.	Download
05/01/2024	514837 - Equipment Transfer & Packaging Quantity Changing. This letter is to inform you that 5045 series will be transferred from Japan vendor to Korea vendor for the productivity improvement & stable delivery performance. It will be changed as follows by this change, so please refer to the information for more details.	Download
02/29/2024	514174 - Change to Product. This notification is to inform you of standardize the sales drawings (SD) in the attached list. For details, please see below.	Download
01/11/2024	514731 - Retraction of PCN 514531. This letter is to inform you that Molex retract the previous PCN to replace with a new PCN by adding change reasons. This change is cancelled because this PCN doesnt include DU/MOQ change so new PCN will be issued for supplier Change & DU/MOQ Change Soon	Download
10/04/2022	512485 - Packaging method/quantity changing. Due to DU discrepancy between MFG plant and SCH, DU needs to be adapted to MFG Plant	Download
03/01/2015	GCM 10671199 - New, Modified, Or Replacement Tooling. The purpose of this letter is to inform you that we plan to kick off new housing tooling(Copy existing tooling)because existing toolings are aging for over 10 years'production. Tool qualification will be done as procedure. This changes only affect Molex ShangHai.	Download