39-30-0080
Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, PA Polyamide Nylon 6/6 94V-0, 2.54µm Matte Tin (Sn) Plating
Part Aliases: Molex 0039300080 Molex 5569-08A2-210
The Mini-Fit Jr. Header is a versatile connectivity solution, featuring a dual-row, right-angle design with a snap-in plastic peg PCB lock for secure installation. With 8 circuits, this header is constructed from PA Polyamide Nylon 6/6 94V-0 material and boasts 2.54µm matte tin (Sn) plating for enhanced durability. Its natural color complements any application, while its compact 4.2mm pitch and 13A amperage make it suitable for various power and signal requirements. With brass contacts and a 600V voltage rating, this header ensures reliable performance in demanding environments. Additionally, its through-hole termination method and PCB locator/retention features facilitate easy assembly. RoHS compliant and lead-free process capable, this header meets stringent environmental standards, making it ideal for a wide range of applications in the electronics industry.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 39-30-0080 |
| Color: | Natural |
| Series: | 5569 - Mini-Fit Jr. |
| Amperage: | 13 A |
| Connector Type: | Mini-Fit Jr. |
| Number of Contacts: | 8 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Right Angle |
| Pitch: | 4.2 mm |
| Voltage: | 600 V |
| Material: | Nylon |
| Orientation: | Right Angle |
| Keying: | No |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.78 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Matte Tin |
| Maximum Solder Process Temperature: | 240 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 4.2 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | No |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0039300080 5569-08A2-210 |
| SKU: | MOL39-30-0080 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
| 05/15/2020 | 508489 - Supplier change. Reel plating process of identified products will be carried out at vendor location. | Download |
| 07/01/2017 | 502703 - Equipment Transfer, Production Transfer or Rearrangement. | Download |
| 03/18/2015 | GCM 10653558 - New, Modified, Or Replacement Tooling. | Download |