43650-0516

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 5 Circuits, with PCB Polarizing Peg, Gold, Glow-Wire Capable, Black

Part Aliases: Molex 0436500516  
The Micro-Fit 3.0 Vertical Header, a reliable and high-performance connectivity solution for your PCB applications. This single-row header features 5 circuits with a durable brass contact material and gold plating, ensuring excellent conductivity and signal integrity. With a low 3.00mm pitch, it offers space-efficient board connectivity. The inclusion of a PCB polarizing peg enhances alignment during installation. Rated for 600V and 8.5A, this header is suitable for a wide range of power and signal transmission tasks. Its straight body orientation and through-hole termination method with kinked pins provide secure and stable mounting. With a wide operating temperature range of -40 to 105°C and glow-wire capability, it guarantees reliable performance even in demanding environments. RoHS compliant and lead-free process compatible, the Micro-Fit 3.0 header is not only performance-driven but also environmentally friendly. Trust in its quality and durability for your wire-to-board and wire-to-wire connections.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
Invalid quantity value
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0516
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:5
Number of Rows:1
Termination Method:Through Hole - Kinked Pin
Contact Material:Brass
Body Orientation:Straight
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:5
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:17.27 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500516
SKU:MOL43650-0516

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
11/22/2024515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales.
Download
06/07/2024514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable.
Download
08/01/2021510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
06/01/2021510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
Download
02/26/2021509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & QualityDownload
12/31/2020508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier.Download