43650-0516
Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 5 Circuits, with PCB Polarizing Peg, Gold, Glow-Wire Capable, Black
Part Aliases: Molex 0436500516
The Micro-Fit 3.0 Vertical Header, a reliable and high-performance connectivity solution for your PCB applications. This single-row header features 5 circuits with a durable brass contact material and gold plating, ensuring excellent conductivity and signal integrity. With a low 3.00mm pitch, it offers space-efficient board connectivity. The inclusion of a PCB polarizing peg enhances alignment during installation. Rated for 600V and 8.5A, this header is suitable for a wide range of power and signal transmission tasks. Its straight body orientation and through-hole termination method with kinked pins provide secure and stable mounting. With a wide operating temperature range of -40 to 105°C and glow-wire capability, it guarantees reliable performance even in demanding environments. RoHS compliant and lead-free process compatible, the Micro-Fit 3.0 header is not only performance-driven but also environmentally friendly. Trust in its quality and durability for your wire-to-board and wire-to-wire connections.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 43650-0516 |
Color: | Black |
Series: | 43650 |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit 3.0 |
Number of Contacts: | 5 |
Number of Rows: | 1 |
Termination Method: | Through Hole - Kinked Pin |
Contact Material: | Brass |
Body Orientation: | Straight |
Pitch: | 3 mm |
Voltage: | 600 V |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .381 µm |
Number of Contacts Loaded: | 5 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | SMC and Wave |
Duration at Max. Process Temperature (seconds): | 030 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | Yes |
Mated Height: | 17.27 mm |
Stackable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit 3.0 |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0436500516 |
SKU: | MOL43650-0516 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download |
06/07/2024 | 514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable. | Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
02/26/2021 | 509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & Quality | Download |
12/31/2020 | 508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier. | Download |