39-30-0160
Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0, 2.54µm Matte Tin (Sn) Plating
Part Aliases: Molex 0039300160 Molex 5569-16A2-210
The Molex Mini-Fit Jr. Header, a versatile connector designed for secure and reliable wire-to-board or wire-to-wire connections in electronic applications. This dual-row header features a right-angle orientation with a snap-in plastic peg PCB lock, ensuring stability and vibration resistance. With 16 circuits and a current rating of 13A, it is suitable for power and signal transmission. Constructed from high-quality PA Polyamide Nylon 6/6 94V-0, and featuring 2.54µm Matte Tin (Sn) Plating, this connector offers excellent durability and conductivity. Its compact design, with a pitch of 4.2mm, allows for high-density mounting, while its operating temperature range of -40 to 105°C ensures performance in harsh environments. RoHS compliant and lead-free process capable, the Mini-Fit Jr. Header is the ideal choice for demanding applications in various industries.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 39-30-0160 |
| Color: | Natural |
| Series: | 5569 - Mini-Fit Jr. |
| Amperage: | 13 A |
| Connector Type: | Mini-Fit Jr. |
| Number of Contacts: | 16 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Right Angle |
| Pitch: | 4.2 mm |
| Voltage: | 600 V |
| Material: | Nylon |
| Orientation: | Right Angle |
| Keying: | No |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 16 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.78 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Matte Tin |
| Maximum Solder Process Temperature: | 240 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 4.2 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | No |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0039300160 5569-16A2-210 |
| SKU: | MOL39-30-0160 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
| 05/15/2020 | 508489 - Supplier change. Reel plating process of identified products will be carried out at vendor location. | Download |
| 07/01/2017 | 502703 - Equipment Transfer, Production Transfer or Rearrangement. | Download |