22-03-2051

ICC Number:	MOL22-03-2051
Manufacturer:	Molex
Manufacturer Number:	22-03-2051
Datasheet:	Datasheet
ECAD Model:

Description:

KK 254 Wire-to-Board Header, Single Row, Vertical, 5 Circuits, PA Polyamide Nylon, Tin (Sn) Plating

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Specifications

Attribute	Value
Product Category:	Connectors PCB Connectors
Manufacturer:	Molex
Manufacturer Part Number:	Molex 22-03-2051
Gender:	Male
Number of Contacts:	5
Number of Rows:	1
Contact Material:	Brass
Contact Plating:	Tin
Pitch:	2.54 mm
Shrouded:	No
Flammability Rating:	UL 94V-0
Current Rating:	4 A
Voltage Rating:	500 V
Mounting Angle:	Straight
Mounting Type:	Through Hole
PCB Connector Type:	PCB Mount Header
SKU:	MOL22-03-2051

Detailed Description

Introducing the 22-03-2051 KK 254 Wire-to-Board Header, a versatile connectivity solution for your electronic projects. This single-row header features 5 circuits, constructed with durable PA Polyamide Nylon and boasting Tin (Sn) plating for enhanced conductivity. Its straight body orientation and vertical termination method make it ideal for through-hole installation, with brass contact material ensuring reliable performance. With a pitch of 2.54mm and a maximum voltage of 500V, this header is suitable for a wide range of applications. It is UL and CSA certified, RoHS compliant, and lead-free solder capable, guaranteeing both quality and environmental responsibility. Upgrade your PCB connections with the 22-03-2051 KK 254 Wire-to-Board Header.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 10-89-7061	2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 6 Circuits, Tin (Sn) Plating, 2.72mm PC Tail Length
	Molex 172286-1102	Ultra-Fit Vertical Header, 3.50mm Pitch, Single Row, 2 Circuits, with Kinked Pins, Tin (Sn), Glow-Wire Capable, Black
	Molex 172286-2102	Ultra-Fit Vertical Header, 3.50mm Pitch, Single Row, 2 Circuits, with Kinked Pins, Tin (Sn) Plating, Natural, Glow-Wire Capable
	Molex 172286-2103	Ultra-Fit Vertical Header, 3.50mm Pitch, Single Row, 3 Circuits, with Kinked Pins, Tin (Sn) Plating, Natural, Glow-Wire Capable
	Molex 172298-1106	Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 6 Circuits, with Kinked Pins, Tin (Sn) Plating, Black, Glow-Wire Capable
	Molex 22-03-2021	KK 254 Wire-to-Board Header, Single Row, Vertical, 2 Circuits, PA Polyamide Nylon, Tin (Sn) Plating
	Molex 22-03-2031	KK 254 Wire-to-Board Header, Single Row, Vertical, 3 Circuits, PA Polyamide Nylon, Tin (Sn) Plating
	Molex 22-03-2061	KK 254 Wire-to-Board Header, Single Row, Vertical, 6 Circuits, PA Polyamide Nylon, Tin (Sn) Plating
	Molex 22-23-2021	KK 254 Solid Header, Vertical, with Friction Lock, 2 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length
	Molex 22-23-2031	KK 254 Solid Header, Vertical, with Friction Lock, 3 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length
	Molex 22-23-2051	KK 254 Solid Header, Vertical, with Friction Lock, 5 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length
	Molex 22-27-2081	KK 254 Header, Vertical, Square Pin, Friction Lock, 8 Circuits, 7.50mm Mating Pin Length, 3.56mm Tail Length, 2.54µm Matte Tin (Sn) Plating
	Molex 22-28-4040	KK 254 Breakaway Header, Vertical, 4 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm
	Molex 39-28-1103	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 10 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 43030-0001	Micro-Fit 3.0 Crimp Terminal, Female, with Tin (Sn) Plated Phosphor Bronze Contact, 24-20 AWG
	Molex 53253-0270	2.00mm Pitch, Micro-Latch PCB Header, Single Row, Vertical, Through Hole, Tin (Sn) Plating, 2 Circuits, 3.50mm PC Tail Length
	Molex 70543-0003	2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 3.30mm Tail Length, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Matte Tin (Sn) Tail Plating
	Molex 90059-0007	2.54mm Pitch C-Grid Micro Shunt, Low Profile, 5.08Âµm Tin (Sn) Plating

Product Change Notice

Effective Date	Description of Change	Download
12/31/2022	512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change	Download
02/28/2022	511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.	Download
03/01/2021	509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)	Download
09/01/2019	507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change.	Download
03/15/2019	506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.	Download
07/01/2017	502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download