22-03-2031

ICC Number:	MOL22-03-2031
Manufacturer:	Molex
Manufacturer Number:	22-03-2031
Datasheet:	Datasheet
ECAD Model:

Description:

KK 254 Wire-to-Board Header, Single Row, Vertical, 3 Circuits, PA Polyamide Nylon, Tin (Sn) Plating

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Specifications

Attribute	Value
Product Category:	PCB Connectors PCB Headers & Receptacles
Manufacturer:	Molex
Manufacturer Part Number:	Molex 22-03-2031
Gender:	Male
Number of Contacts:	3
Number of Rows:	1
Contact Material:	Brass
Contact Plating:	Tin
Pitch:	2.54 mm
Shrouded:	No
Flammability Rating:	UL 94V-0
Current Rating:	4 A
Voltage Rating:	500 V
Mounting Angle:	Straight
Mounting Type:	Through Hole
PCB Connector Type:	PCB Mount Header
SKU:	MOL22-03-2031

Detailed Description

Introducing the 22-03-2031 KK 254 Wire-to-Board Header, a single-row vertical connector designed for seamless board-to-board or wire-to-board connections. With 3 circuits and durable PA Polyamide Nylon construction, this header ensures reliable performance in a variety of applications. The Tin (Sn) plating offers excellent conductivity and corrosion resistance, while the straight body orientation and 2.54mm pitch allow for easy installation. Rated for 4A and 500V, this connector is suitable for high-power and high-voltage environments. CSA and UL certified, as well as RoHS compliant, guaranteeing quality and environmental responsibility. Perfect for use in PCB assemblies, this KK 254 header is a versatile and dependable connectivity solution.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 15-38-1024	2.54mm Pitch C-Grid Shunt Terminal Housings, Overall Tin (Sn), 2 Circuits, with Open End
	Molex 22-03-2021	KK 254 Wire-to-Board Header, Single Row, Vertical, 2 Circuits, PA Polyamide Nylon, Tin (Sn) Plating
	Molex 22-03-2051	KK 254 Wire-to-Board Header, Single Row, Vertical, 5 Circuits, PA Polyamide Nylon, Tin (Sn) Plating
	Molex 22-04-1031	Mini-Latch / KK Wire-to-Board Header, Vertical, with Friction Ramp, 3 Circuits, Tin (Sn) Plating, Natural
	Molex 22-23-2021	KK 254 Solid Header, Vertical, with Friction Lock, 2 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length
	Molex 22-23-2041	KK 254 Solid Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating
	Molex 22-23-2051	KK 254 Solid Header, Vertical, with Friction Lock, 5 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length
	Molex 22-23-2061	KK 254 Solid Header, Vertical, with Friction Lock, 6 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length
	Molex 22-27-2041	KK 254 Header, Vertical, Square Pin, Friction Lock, 4 Circuits, 7.50mm Mating Pin Length, 3.56mm Tail Length, 2.54µm Matte Tin (Sn) Plating
	Molex 26-48-1055	KK 396 Breakaway Header, Vertical, Square Pin, with Friction Lock, 5 Circuits, 1.52µm Matte Tin (Sn) Plating, 4.37mm Tail Length, 11.43mm Mating Pin Length
	Molex 39-29-9023	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 2 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 39-29-9203	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 20 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 500075-0517	Mini USB, B-Receptacle, Vertical, Through Hole Solder Tails and Shell Tabs with Dimples
	Molex 53047-0610	1.25mm Pitch, PicoBlade PCB Header, Single Row, Vertical, Through Hole, Tin Plating, Friction Lock, 6 Circuits, 2.30mm PC Tail Length
	Molex 53398-0271	1.25mm Pitch, PicoBlade PCB Header, Single Row, Vertical, Surface Mount, Tin (Sn) Plating, Friction Lock, 2 Circuits, Tape and Reel, 0.60mm PC Tail Length
	Molex 53398-0371	1.25mm Pitch, PicoBlade PCB Header, Single Row, Vertical, Surface Mount, Tin (Sn) Plating, Friction Lock, 3 Circuits, Tape and Reel, 0.60mm PC Tail Length
	Molex 70543-0003	2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 3.30mm Tail Length, 4 Circuits, 0.38µm Gold (Au) Selective Plating, Matte Tin (Sn) Tail Plating

Product Change Notice

Effective Date	Description of Change	Download
12/31/2022	512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change	Download
09/30/2021	510768 - Packaging Method/Quantity Changing. proposed packaging is bulk packaging with air inflated bags, DU qty will increase from 16,000 to 20,000.	Download
03/01/2021	509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)	Download
09/01/2019	507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change.	Download
03/15/2019	506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.	Download
07/01/2017	502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download