22-03-2041

ICC Number:	MOL22-03-2041
Manufacturer:	Molex
Manufacturer Number:	22-03-2041
Datasheet:	Datasheet
ECAD Model:

Description:

KK 254 Wire-to-Board Header, Single Row, Vertical, 4 Circuits, PA Polyamide Nylon, Tin (Sn) Plating

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Specifications

Attribute	Value
Product Category:	PCB Connectors PCB Headers & Receptacles
Manufacturer:	Molex
Manufacturer Part Number:	Molex 22-03-2041
Gender:	Male
Number of Contacts:	4
Number of Rows:	1
Contact Material:	Brass
Contact Plating:	Tin
Pitch:	2.54 mm
Shrouded:	No
Flammability Rating:	UL 94V-0
Current Rating:	4 A
Voltage Rating:	500 V
Mounting Angle:	Straight
Mounting Type:	Through Hole
PCB Connector Type:	PCB Mount Header
SKU:	MOL22-03-2041

Detailed Description

Introducing the 22-03-2041 KK 254 Wire-to-Board Header, a high-quality connector designed for efficient PCB assembly. This single-row header features a vertical orientation and 4 circuits, made with durable PA Polyamide Nylon material and tin plating for enhanced conductivity. With a natural (white) color and a compact pitch of 2.54 mm, it offers versatility for various applications. Rated for 4 A and 500 V, this connector ensures reliable power and signal transmission. Its through-hole termination method and brass contact material guarantee secure and stable connections. RoHS compliant and lead-free process capable, the KK 254 header meets industry standards for environmental responsibility. Perfect for board-to-board and wire-to-board connections, this connector is a dependable solution for your PCB assembly needs.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 19073-0167	Avikrimp Ring Tongue Terminal for 12-10 AWG Wire, Stud Size 8 (M4), Length 27.71mm, Yellow, Mylar Tape Carrier
	Molex 22-04-1021	Mini-Latch / KK Wire-to-Board Header, Vertical, with Friction Ramp, 2 Circuits, Tin (Sn) Plating, Natural
	Molex 35363-0860	2.00mm Pitch Sherlock Wire-to-Board Header, Right-Angle, with Positive Lock, 8 Circuits
	Molex 39-28-1043	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 4 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 43045-0200	Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 2 Circuits, with Snap-in Plastic Peg PCB Lock, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black
	Molex 43160-2104	Sabre Vertical Header, 7.50mm Pitch, 4 Circuits, Glow-Wire Capable, 3.81mm Tail Length, for 1.60mm PCB, with Board Lock
	Molex 43650-0215	Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 2 Circuits, with PCB Polarizing Peg, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black
	Molex 43650-0319	Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 3 Circuits, with PCB Press-fit Metal Retention Clip, 0.38µm Gold Plating, Glow-Wire Capable, Black
	Molex 53398-0771	1.25mm Pitch, PicoBlade PCB Header, Single Row, Vertical, Surface Mount, Tin (Sn) Plating, Friction Lock, 7 Circuits, 0.60mm PC Tail Length
	Molex 54819-0519	Mini USB, B-Receptacle, Right-Angle, Through Hole Solder Tails and Shell Tabs, Lead-Free
	Molex 55932-0230	MicroClasp Vertical Header, 2.00mm Pitch, Single Row, Through Hole, Tin (Sn) Plating, 2 Circuits, without PCB Locator
	Molex 55932-0510	MicroClasp Vertical Header, 2.00mm Pitch, Single Row, Through Hole, Tin (Sn) Plating, 5 Circuits, with PCB Locator
	Molex 73251-2201	SMA Jack, Right-Angle, Bulkhead Receptacle, PCB, Through Hole, Brass Body, Gold (Au) Plated, Jam Nut and Lockwasher Included, 2.79mm Leg Length, 50 Pieces Per Tray, 50 Ohms
	Molex 90059-0009	2.54mm Pitch C-Grid Micro Shunt, Low Profile, 0.381Âµm Select Gold (Au) with Gold (Au) Flash Plating

Product Change Notice

Effective Date	Description of Change	Download
12/31/2022	512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change	Download
02/28/2022	511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.	Download
03/01/2021	509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)	Download
09/01/2019	507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change.	Download
03/15/2019	506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.	Download
07/01/2017	502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download