15-91-2100

Heilind Number:MOL15-91-2100
Manufacturer:Molex
Manufacturer Number:15-91-2100
Datasheet:Drawing
ECAD Model:
3D Model

Description:

2.54mm Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 10 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 15-91-2100
Color:Black
Series:71308 - C-Grid
Amperage:3 A
Connector Type:C-Grid
Number of Contacts:10
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Body Orientation:Straight
Pitch:2.54 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:3.81 µm
Number of Contacts Loaded:10
Mating Cycles:25
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:3.81 µm
Polarized to Mate:No
Connector System:Board to Board, Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:245 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:No
Lock to Mating Part:No
Stackable:Yes
Breakaway:Yes
Shroud Type:No
Material Flammability Standard:94V-0
Part Aliases:0015912100 71308-0010N
SKU:MOL15-91-2100

Detailed Description

Introducing the 15-91-2100, a high-performance black C-Grid connector from our 71308 series. Designed for reliability, it features 10 contacts in a 2-row configuration, with surface mount termination for easy installation. Constructed with phosphor bronze contact material and a high-temperature thermoplastic body, this connector is rated for 3A and 250V, ensuring robust performance in demanding applications. With a pitch of 2.54mm and tin plating on the contact mating area, it offers efficient signal transmission. RoHS compliant and lead-free reflow solder compatible, the 15-91-2100 is ideal for board-to-board and wire-to-board connections in various electronic devices. With its compact vertical orientation and stackable, breakaway design, it provides versatility and ease of use, making it a reliable choice for your connectivity needs.