2102771-1
DC, 7Row, Center, MULTIGIG RT 2R
The 2102771-1 is a high-performance backplane connector featuring a 7-row, right angle design for efficient board-to-board connections. With a total of 112 contacts and a current rating of 1A, this connector is ideal for power and signal applications in demanding environments. Its rugged construction and operating temperature range of -55 to 105°C ensure reliable performance. Fully shrouded and with a center guide location, it offers enhanced mating alignment and stability. Designed for use in military, aerospace, and other harsh environments, the 2102771-1 is a dependable solution for high-reliability applications.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102771-1 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 112 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Center |
| Part Aliases: | 2102771-1 |
| SKU: | AMP2102771-1 |
Frequently bought together
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |
| 03/02/2022 | P-21-021955 - Product improvement.To increase capacity and provide alternative manufacturing options for risk management. You are hereby informed that this second manufacturing line will be introduced on/or around March 1st , 2022. This line will follow the same strict procedure which fully maintains quality, ability to supply, and form-fit-function of the concerned products. New Manufacturing process will operate under the same certified quality management system. | Download |