1410975-3
MULTIGIG RT2 7RW DC RTM CT
The MULTIGIG RT2 7RW DC RTM CT is a high-performance board-to-board connector designed for aerospace, defense, and marine applications. With a ruggedized construction, this connector is ideal for use in harsh environments. Featuring a right-angle board mount orientation and 1.8mm pitch, it allows for space-saving and efficient PCB connections. With 112 contacts arranged in 7 rows, it provides ample connectivity options. Fully shrouded and with polarization for mating alignment, it ensures secure and reliable connections. Operating temperature range from -55 to 105°C (-67 to 221°F) and RoHS compliance make it suitable for a wide range of industries. The 1410975-3 connector is in stock and ready for immediate shipping.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1410975-3 |
| Series: | MULTIGIG RT 2 |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 112 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .071 in, 1.8 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| GPL: | B54 |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Aerospace Defense & Marine |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | F029 |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Center |
| Part Aliases: | 1410975-3 |
| SKU: | AMP1410975-3 |
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |