2102772-1
DC, 7Row, Half Left End, MULTIGIG RT 2R
The 2102772-1 is a high-performance board-to-board backplane connector designed for demanding applications. Featuring 56 contacts arranged in 7 rows, with a pitch of 1.9mm, this connector ensures reliable power and signal transmission. Its rugged design, with a right-angle body orientation and fully shrouded construction, offers excellent durability and EMI protection. Operating in a wide temperature range from -55 to 105°C, it is suitable for harsh environments. With a mating alignment for easy installation and termination to a printed circuit board, this connector is ideal for high-speed and high-density applications in industries such as telecommunications, data centers, and industrial equipment. Please note, this product is not RoHS compliant.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102772-1 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 56 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 56 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 8 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Left |
| Part Aliases: | 2102772-1 |
| SKU: | AMP2102772-1 |
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |