1410971-3
MULTIGIG RT T2 7RW H-LFT RTM
The MULTIGIG RT T2 7RW H-LFT RTM is a high-performance board-to-board connector designed for power and signal applications in demanding environments. With a compact right-angle body orientation and 1.8mm pitch, this connector offers efficient space-saving solutions for your PCB designs. Featuring 56 contacts arranged in 7 rows, it provides ample connectivity options. Operating in a wide temperature range from -55 to 105°C, it ensures reliable performance in harsh conditions. Fully shrouded and with a mating alignment for polarization, it guarantees secure and accurate connections. This connector, with the SKU 1410971-3, is a versatile and essential component for your industrial and commercial electronic systems. Please note that it is not RoHS compliant.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1410971-3 |
| Series: | MULTIGIG RT 2 |
| Amperage: | 1 A |
| Gender: | Plug |
| Number of Contacts: | 56 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .071 in, 1.8 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 56 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 8 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Left |
| Part Aliases: | 1410971-3 |
| SKU: | AMP1410971-3 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/10/2022 | P-22-023166 - Product improvement. Increase width of the wafer slots on the housing by 0.09mm in order to reduce the risk of FOD (Foreign Object debris) that can be generated by insertion of the wafers during part assembly. | Download |