78727-0001
1.40mm Height Push-Pull micro-SIM Card Socket with Detect Switch, Surface Mount, 6 Circuits, Low-Halogen, Lead-Free
Part Aliases: Molex 0787270001
The 78727-0001, a high-performance micro-SIM connector designed for seamless connectivity in electronic devices. With a compact design and featuring a surface mount termination method, this connector is ideal for space-constrained applications. Boasting a durable construction with a shell made of stainless steel, it ensures reliable performance even in demanding environments. Gold over nickel contact plating guarantees excellent conductivity and corrosion resistance, while a low operating temperature of -40°C ensures functionality in extreme conditions. Suitable for Micro-SIM cards, this connector is perfect for mobile devices, IoT applications, and more. With RoHS compliance and lead-free process capability, it meets stringent environmental standards. Trust the 78727-0001 for secure and efficient connectivity in your designs.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 78727-0001 |
Series: | 78727 - micro-SIM |
Amperage: | .5 A |
Connector Type: | micro-SIM |
Number of Contacts: | 6 |
Termination Method: | Surface Mount |
Contact Material: | Copper Alloy |
Contact Plating: | Gold Over Nickel |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -40 °C |
Pitch: | 2.54 mm |
Voltage: | 10 V DC |
Compatible Card Type: | Micro-SIM |
Shell Material: | Stainless Steel |
Packaging: | Embossed Tape on Reel |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold over Nickel |
Contact Mating Area Plating Thickness: | 2.54 mm |
Number of Contacts Loaded: | 6 |
Mating Cycles: | 500 |
PCB Locator: | No |
Shielded: | Yes |
PCB Retention: | Yes |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 003 |
Max. Cycles at Max. Process Temperature: | 003 |
Card Detection Switch: | Closed |
Card Entry Location: | Front |
Part Aliases: | 0787270001 |
SKU: | MOL78727-0001 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download |
02/27/2022 | 511276 - Change Supplier. add alternative copper materials "YCuT-FX-EH", JPN DOWA HOLDINGS. Current "NKT322 ESH" JPN Nippon alternative: "YCuT-FX-EH", JPN DOWA HOLDINGS. | Download |
09/26/2020 | 508585 - Change to Product. Improvement to metal shell surface plating changing from matte tin to nickel. no impact to form fit or function | Download |
11/18/2017 | 502609 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download |
05/22/2014 | GCM 10634281 - Outsourcing Component Or Subcomponent. Because the order of Micro SIM card connector 78727 series are increase,the machine of insert mold is shortage and can't cover current capacity.The purpose of the change is cover current capacity.So we will copy mold and transfer mold to outsourcing supplier for component on insert mold HSG.The Change is no impact for FG. | Download |