| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 78727-0001 |
| Part Aliases: | 0787270001 |
| SKU: | MOL78727-0001 |
78727-0001
Specifications
Detailed Description
Introducing the 78727-0001, a high-performance micro-SIM connector designed for seamless connectivity in electronic devices. With a compact design and featuring a surface mount termination method, this connector is ideal for space-constrained applications. Boasting a durable construction with a shell made of stainless steel, it ensures reliable performance even in demanding environments. Gold over nickel contact plating guarantees excellent conductivity and corrosion resistance, while a low operating temperature of -40°C ensures functionality in extreme conditions. Suitable for Micro-SIM cards, this connector is perfect for mobile devices, IoT applications, and more. With RoHS compliance and lead-free process capability, it meets stringent environmental standards. Trust the 78727-0001 for secure and efficient connectivity in your designs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 53261-0671 | 1.25mm Pitch, PicoBlade PCB Header, Single Row, Right-Angle, Surface Mount, Tin (Sn) Plating, Friction Lock, 6 Circuits, Natural, Tape and Reel |  |
 | Molex 53398-1071 | 1.25mm Pitch, PicoBlade PCB Header, Single Row, Vertical, Surface Mount, Tin (Sn) Plating, Friction Lock, 10 Circuits, 0.60mm PC Tail Length | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download | |||
| 02/27/2022 | 511276 - Change Supplier. add alternative copper materials "YCuT-FX-EH", JPN DOWA HOLDINGS. Current "NKT322 ESH" JPN Nippon alternative: "YCuT-FX-EH", JPN DOWA HOLDINGS. | Download | |||
| 09/26/2020 | 508585 - Change to Product. Improvement to metal shell surface plating changing from matte tin to nickel. no impact to form fit or function | Download | |||
| 11/18/2017 | 502609 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download | |||
| 05/22/2014 | GCM 10634281 - Outsourcing Component Or Subcomponent. Because the order of Micro SIM card connector 78727 series are increase,the machine of insert mold is shortage and can't cover current capacity.The purpose of the change is cover current capacity.So we will copy mold and transfer mold to outsourcing supplier for component on insert mold HSG.The Change is no impact for FG. | Download | |||
Availability
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Unit Of Measure:
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Minimum/Multiple:
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 78727-0001 |
| Other Names: | 0787270001 |