71436-2164
1.00mm Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, Vertical Stacking, 64 Circuits, 8.35mm Unmated Height, with PCB Locator Pegs, without Robotic Placement Metal Cap, 0.76
Part Aliases: Molex 0714362164
The 71436-2164 is a high-performance 1.00mm Mezz (IEEE 1386) connector designed for seamless board-to-board connections in electronic applications. With 64 gold-plated contacts and a straight body orientation, it ensures reliable signal transmission with minimal interference. This surface-mount connector, made of high-temperature thermoplastic, operates efficiently in extreme environments ranging from -55 to 85°C. It is UL and CSA certified, guaranteeing compliance with safety standards. Featuring a compact vertical orientation and a low mated height of 10-15mm, it is ideal for space-restricted designs. RoHS compliant and lead-free reflow solder capable, this connector is not only environmentally friendly but also offers easy and efficient assembly. Whether for industrial machinery, telecommunications, or consumer electronics, the 71436-2164 is the perfect choice for demanding connectivity needs.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 71436-2164 |
Color: | Natural |
Series: | 71436 - 1.00mm Mezz (IEEE 1386) |
Amperage: | 1 A |
Connector Type: | 1.00mm Mezz (IEEE 1386) |
Number of Contacts: | 64 |
Number of Rows: | 2 |
Termination Method: | Surface Mount |
Contact Material: | Phosphor Bronze |
Body Orientation: | Straight |
Pitch: | 1 mm |
Voltage: | 100 V |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Packaging: | Tube |
Operating Temperature Range: | -55 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 64 |
PCB Locator: | Yes |
PCB Retention: | Without |
Contact Termination Plating Thickness: | 1.905 µm |
Polarized to Mate: | No |
PCB Thickness (Recommended): | 1 mm |
Connector System: | Board to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 040 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | No |
Lock to Mating Part: | No |
Mated Height: | 10 mm, 12 mm, 13 mm, 15 mm |
Stackable: | No |
Breakaway: | No |
Shroud Type: | Fully |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0714362164 |
SKU: | MOL71436-2164 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
03/08/2024 | 514164 - Equipment Transfer, Production Transfer or Rearrangement. In order to increase the Molex manufacturing footprint, Molex will transfer the existing assembly lines to a local qualified assembly vendor | Download |
09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download |
12/06/2018 | 505463 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |
10/16/2017 | 503117 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download |