50394-8054

Milli-Grid Crimp Terminal, Female, Gold (Au) Flash, Reel, Lead free

Part Aliases: Molex 0503948054  
The 50394-8054 Milli-Grid Crimp Terminal, a high-quality female connector designed for reliable signal transmission in electronic applications. This terminal features a durable copper alloy construction with a gold flash plating for enhanced conductivity and corrosion resistance. With a versatile crimp or compression termination method, it accommodates 24-30 AWG wires, making it ideal for a wide range of wire-to-wire or wire-to-board connections. RoHS compliant and lead-free, this terminal is suitable for environmentally sensitive projects. It is packaged on a convenient reel for easy handling and storage. Trust the 50394-8054 for secure and efficient power and signal distribution in your electronic systems.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
Invalid quantity value
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 50394-8054
Series:50394 - Milli-Grid
Connector Type:Milli-Grid
Gender:Female
Termination Method:Crimp or Compression
Contact Material:Copper Alloy
Contact Plating:Nickel
Packaging:Reel
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.051 µm
Contact Termination Plating Thickness:2.032 µm
Wire Size:24 AWG, 26 AWG, 28 AWG, 30 AWG
Connector System:Wire to Board, Wire to Wire
Contact Termination Plating:Nickel
Wire Insulation Diameter:1.4 mm
Part Aliases:0503948054
SKU:MOL50394-8054

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
10/20/2020508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability.
the plating process change from dipping + brushing -> selective dipping + spotting.
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