47352-1001

Heilind Number:	MOL47352-1001
Manufacturer:	Molex
Manufacturer Number:	47352-1001
Datasheet:	Product Specification
ECAD Model:

Description:

1.10mm Pitch microSD Card Connector, Push-Push Type, with VSS (Supply Voltage Ground) Detect Switch, Lead-Free

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Specifications

Attribute	Value
Product Category:	Memory Sockets & Connectors SD & Micro-SD Memory Card Connectors
Manufacturer:	Molex
Manufacturer Part Number:	Molex 47352-1001
Color:	Black
Series:	47352 - microSD Card
Amperage:	.5 A
Connector Type:	microSD Card
Housing Material:	Thermoplastic
Number of Contacts:	8
Termination Method:	Surface Mount
Contact Material:	Copper Alloy
Contact Plating:	Gold Over Nickel
Maximum Operating Temperature:	85 °C
Minimum Operating Temperature:	-20 °C
Pitch:	1.1 mm
Voltage:	100 V DC
Material:	High Temperature Thermoplastic
Shell Material:	Stainless Steel
Packaging:	Embossed Tape on Reel
Operating Temperature Range:	-20 - 85 °C
Contact Mating Area Plating:	Gold over Nickel
Number of Contacts Loaded:	8
Mating Cycles:	5000
PCB Locator:	No
Shielded:	Yes
PCB Retention:	Yes
CSA Agency Certification:	LR19980
UL Agency Certification:	E29179
Contact Termination Plating:	Tin
Maximum Solder Process Temperature:	250 °C
Lead Free Process Capability:	REFLOW
Duration at Max. Process Temperature (seconds):	010
Max. Cycles at Max. Process Temperature:	002
Termination Pitch:	1.1 mm
Card Detection Switch:	Open
Card Entry Location:	Front
Material Flammability Standard:	94V-0
Part Aliases:	0473521001
SKU:	MOL47352-1001

Detailed Description

Easily expand the storage capabilities of your devices with the 47352-1001 microSD Card Connector. This black connector, part of the 47352 series, features a durable thermoplastic housing and surface mount termination for reliable performance. With 8 gold-plated copper alloy contacts, it ensures efficient data transfer at up to 100 V DC. Operating in a wide temperature range from -20 to 85 °C, this connector is suitable for various environments. Its embossed tape packaging and compatibility with lead-free processes make it convenient for assembly. With CSA and UL certifications, as well as RoHS compliance, you can trust in the quality and reliability of this essential component for your electronic projects.

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Product Change Notice

Effective Date	Description of Change	Download
01/03/2025	515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change.	Download
04/30/2023	513394 - Retraction modification of PCN 512019. this pcn is to make some modifications to the previous pcn 512019 because of resource and strategy adjustment molex decides to suspend alternative material study/qualification on some products during this PCN	Download
07/14/2022	512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function.	Download
08/01/2021	510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system.	Download
06/01/2021	510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.	Download
10/31/2020	508651 - Change to Product. Micro SD card 47352xxxx HSG modified product structure to improve warpage, materials change from LCP W471i to LCP E481i. no change to form fit or function.	Download
09/05/2018	505141 - Change to Product. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change may affect the fit, form, function or appearance of the parts, or it may result in a change to the specification.	Download
03/20/2017	501622 - Equipment Transfer, Production Transfer or Rearrangement.	Download
06/17/2016	500583 - Change to Product. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts.	Download
06/16/2016	500627 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling.	Download
06/06/2016	500658 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change.	Download
07/26/2015	GCM 10669487 - Supplier Change. The purpose of this letter is to inform you that Molex decide transfer outsource plating in house. The reason of this change is to avoid quality risk from outsource plating.	Download