43860-0007
Modular Jack, Right Angle, Low Profile, Inverted, Lightpipes, 8/8
Part Aliases: Molex 0438600007
The 43860-0007 is a high-performance Modular Jack designed for Ethernet and fiber optic connectivity. Featuring a right angle, low profile, and inverted design, this female RJ45 connector is ideal for panel mount applications. Constructed with durable polycarbonate and high-temperature thermoplastic, it offers reliable performance in harsh environments. Gold-plated phosphor bronze contacts ensure excellent signal integrity, with a rated amperage of 1.5A and voltage of 150V AC/DC. With UL and CSA agency certifications, as well as RoHS compliance, this connector meets stringent quality and environmental standards. Perfect for use in telecommunications, networking, and industrial applications, the 43860-0007 guarantees robust and dependable connectivity.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43860-0007 |
| Color: | Black, Clear |
| Series: | 43860 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Mount Type: | Panel Mount |
| Termination Method: | Through Hole |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 150 V AC/DC |
| Material: | High Temperature Thermoplastic, Polycarbonate |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Mating Cycles: | 500 |
| Panel Mount: | With |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Lead Free Process Capability: | WAVE |
| Termination Pitch: | 1.02 mm |
| Surface Mount Compatible: | No |
| Waterproof Dustproof: | No |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0438600007 |
| SKU: | MOL43860-0007 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 09/30/2024 | 515041 - Change Supplier. This notification is to inform you about Modjack products’ current light pipe mold is going end of life, Molex ChengDu will replace it with new copy mold from a different supplier. | Download |
| 05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download |
| 06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Download |