| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 44620-0002 |
| Color: | Black |
| Series: | 44620 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Mount Type: | Panel Mount |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 150 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Ground to Panel / PCB: | Yes |
| Mating Cycles: | 500 |
| Panel Mount: | With |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.02 mm |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0446200002 |
| SKU: | MOL44620-0002 |
44620-0002
Specifications
Detailed Description
Introducing the 44620-0002, a high-performance Modular Jack designed for seamless connectivity in electronic systems. This Right Angle, Low Profile, Inverted jack features 8/8 configuration, ensuring reliable data transmission. With a sleek Black finish and durable construction, it is perfect for various applications. The RJ45 connector type, along with Brass and Phosphor Bronze contact material plated with Gold, guarantees excellent signal integrity. Its Panel Mount, Through Hole termination method, and 1.02 mm pitch offer easy installation on PCBs. Rated for 150 V AC/DC and 1.5 A, this jack is suitable for demanding environments. With UL and CSA certifications, as well as RoHS compliance, you can trust in its quality and reliability. Upgrade your connectivity solutions with the 44620-0002 Modular Jack.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 02-06-6122 | 1.57mm Diameter, Standard .062 Pin and Socket PC Tail Terminal, Series 1778, Male, with Selective Gold (Au) Plated Brass Contact, Bag |  |
 | Molex 105309-1103 | Nano-Fit Vertical Header, Through Hole, 2.50mm Pitch, Single Row, 3 Circuits, with Kinked Pins, Tin (Sn) Plating, Black | |
 | Molex 15-91-2065 | 2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.38 | |
 | Molex 22-27-2031 | KK 254 Wire-to-Board Header, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating | |
 | Molex 39-31-0040 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 4 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural | |
 | Molex 43045-0602 | Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 6 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black | |
 | Molex 43045-0614 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 6 Circuits, with PCB Polarizing Peg, Gold, Glow-Wire Capable, Black | |
 | Molex 43650-0416 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 4 Circuits, with PCB Polarizing Peg, Gold, Glow-Wire Capable, Black | |
 | Molex 70553-0001 | 2.54mm Pitch SL Header, Low Profile, Single Row, Right Angle, 3.05mm Pocket, Shrouded, 2 Circuits, 0.38 | |
 | Molex 73171-2360 | 50 Ohms, BNC Right-Angle, PCB Jack, Die Cast | |
 | Molex 90059-0007 | 2.54mm Pitch C-Grid Micro Shunt, Low Profile, 5.08 | |
 | Molex 90131-0763 | 2.54mm Pitch C-Grid III Header, Dual Row, Vertical, 6 Circuits, 0.38 | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download | |||
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
| 11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download | |||
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download | |||
| 01/04/2016 | GCM 10732378 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Download | |||
| 06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Download | |||
Availability
Immediate Shipment:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| Molex: | 44620-0002 |
| Other Names: | 0446200002 |
