43650-0218

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 2 Circuits, with PCB Press-fit Metal Retention Clip, Tin, Glow-Wire Capable, Black

Part Aliases: Molex 0436500218  
The Micro-Fit 3.0 Vertical Header is a high-performance connector designed for reliable power and signal transmission in various electronic applications. With a narrow 3.00mm pitch and featuring a single row with 2 circuits, this header is perfect for space-constrained PCB layouts. The inclusion of a PCB press-fit metal retention clip ensures secure and stable board attachment, while the tin plating and glow-wire capability guarantee enhanced safety and durability. Constructed from high-temperature thermoplastic and rated for operation in a wide range of environments (-40 to 105 °C), this connector offers long-term reliability. Its straight body orientation and through-hole kinked pin termination method make it easy to install, and with a current rating of 8.5 A and voltage withstand of 600 V, it is suitable for demanding applications. RoHS compliant and lead-free process compatible, the Micro-Fit 3.0 is a dependable choice for your connectivity needs.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
Invalid quantity value
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0218
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:2
Number of Rows:1
Termination Method:Through Hole - Kinked Pin
Contact Material:Brass
Body Orientation:Straight
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:2.54 µm
Number of Contacts Loaded:2
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:17.27 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500218
SKU:MOL43650-0218

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
11/22/2024515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales.
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06/07/2024514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable.
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08/01/2021510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
06/01/2021510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
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02/26/2021509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & QualityDownload
12/31/2020508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier.Download
05/06/2015GCM 10664055 - Manufacturing Process Change.Download