43045-1400

Heilind Number:MOL43045-1400
Manufacturer:Molex
Manufacturer Number:43045-1400
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 14 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Glow-Wire Capable, Black

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43045-1400
Color:Black
Series:43045
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:14
Number of Rows:2
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:.254 µm
Number of Contacts Loaded:14
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:10.29 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0430451400
SKU:MOL43045-1400

Detailed Description

The Micro-Fit 3.0 Right-Angle Header is a high-performance connector designed for reliable power and signal transmission in various electronic applications. With a compact 3.00mm pitch and featuring 14 circuits arranged in a dual row configuration, this header offers efficient connectivity. The inclusion of a snap-in plastic peg PCB lock ensures secure mating and PCB retention. Tin contact mating area plating, with a thickness of .254 µm, guarantees excellent conductivity and corrosion resistance. Rated for 600 V and 8.5 A, with glow-wire capability and a wide operating temperature range from -40 to 105 °C, this header is both durable and versatile. RoHS compliant and suitable for lead-free soldering processes, it meets international environmental standards. The Micro-Fit 3.0 is a dependable solution for wire-to-board and wire-to-wire connections in various industries.