43045-1218
Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 12 Circuits, with Solder Tab, Tin, Glow-Wire Capable, Black
Part Aliases: Molex 0430451218
The Micro-Fit 3.0 Vertical Header is a high-performance connector designed for efficient wire-to-board or wire-to-wire connections in electronic applications. With a compact 3.00mm pitch and featuring 12 circuits arranged in a dual row configuration, this header offers versatility in connectivity. Each contact is rated for 8.5 A, ensuring reliable power transmission. The surface mount termination method with solder tabs guarantees secure and durable attachment to the PCB. Constructed from high temperature thermoplastic with a flammability standard, this header is robust and safe for use. Its tin-plated brass contacts and glow-wire capability further enhance its reliability. Fully shrouded and polarized for foolproof mating, this connector has a voltage rating of 600 V and operates in a wide temperature range from -40 to 105 °C, making it ideal for various industrial and commercial applications. RoHS compliant and lead-free reflow soldering capable, the Micro-Fit 3.0 header meets stringent environmental and manufacturing standards. Elevate your connectivity solutions with this premium quality, Molex Wire-to-Board/Wire-to-Wire connector.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43045-1218 |
| Color: | Black |
| Series: | 43045 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 12 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | .254 µm |
| Number of Contacts Loaded: | 12 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | Yes |
| Mated Height: | 17.64 mm |
| Stackable: | No |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0430451218 |
| SKU: | MOL43045-1218 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 08/05/2025 | 516255 - Change Supplier. Due to existing resin supplier capacity constraint issue we must qualify second resin source to avoid production line down. | Download |
| 05/31/2023 | 512820 - Manufacturing Process Change. We are making changes to our manufacturing process to increase productivity to meet current and future capacity demands and improve on time delivery. | Download |
| 03/31/2023 | 513478 - Retraction of PCN 512489. This notification is to advise you of a Cancellation to a previously issued PCN. the previous issued PCN 512489 will not be implemented due to disagreement by impacted customers. | Download |
| 03/10/2023 | 513355 - Retract the PCN 512820 to redefine the scope of the change. this notification is to advise you of a modification to a previously issued PCN 512820, manufacturing process change for the parts listed in this notice is changing no changes will be made to the product as part of this change will add new assembly manual process to improve our capacity to meet future demands. | Download |
| 10/10/2022 | 512489 - Change Supplier.This notification is to inform you about change of supplier impacting the part(s) attached as per list, No changes will be made to product as part of this change change LCP resin supplier but the resin LCP black is not changed before: Celanese LCP After: Kingfa LCP | Download |
| 01/15/2022 | 511003 - Equipment Transfer, Production Transfer or Rearrangement. To ensure continuity of supply molex has decided to transfer Micro-fit series 43045 header housing molds from little rock, AR plant to Nogales, Mexico plant additional capacity tooling will be added as need to ensure a smooth transition from one plant to another. | Download |
| 09/15/2021 | 509622 - Equipment Transfer, Production Transfer or Rearrangement. to ensure continuity of supply, molex has decided to transfer Micro-Fit series 43025 crimp housing & 43045 header housing molds from Little Rock, AR plant to Shanghai China plant. additional capacity tooling will be added as need to ensure a smooth transition from one plant to another. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 07/01/2017 | 502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |