43045-0412

Heilind Number:MOL43045-0412
Manufacturer:Molex
Manufacturer Number:43045-0412
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 4 Circuits, with PCB Polarizing Peg, Tin, Glow-Wire Capable, Black

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43045-0412
Color:Black
Series:43045
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:4
Number of Rows:2
Termination Method:Through Hole - Kinked Pin
Contact Material:Brass
Body Orientation:Straight
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Vertical
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Tin
Contact Mating Area Plating Thickness:.254 µm
Number of Contacts Loaded:4
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:17.64 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0430450412
SKU:MOL43045-0412

Detailed Description

The Micro-Fit 3.0 Vertical Header is a high-performance connectivity solution designed for precision applications. With a pitch of 3.00mm and featuring a dual-row configuration, this header ensures secure and reliable connections in circuitry. Boasting 4 circuits and equipped with a PCB polarizing peg, it facilitates efficient cable management. The tin plating and glow-wire capability enhance safety and durability, while the black high-temperature thermoplastic construction guarantees resilience in harsh environments. With straight body orientation and through-hole kinked pin termination, this header offers ease of installation. Meeting stringent quality standards, including RoHS compliance, it is suitable for a wide range of industries, from automotive to telecommunications. Trust in the Micro-Fit 3.0 for seamless wire-to-board connectivity in your applications.