| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 26-61-4040 |
| Gender: | Male |
| Number of Contacts: | 4 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold, Tin |
| Pitch: | 3.96 mm |
| Shroud Type: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 7 A |
| Voltage Rating: | 600 V |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL26-61-4040 |
26-61-4040
Specifications
Detailed Description
Introducing the Molex KK 396 Header, a versatile vertical connector designed for reliable board-to-wire connections. With 4 circuits and gold plating, this header ensures excellent conductivity and signal integrity. Its straight body orientation and through-hole termination method make it easy to install on PCBs. Rated for 7A and 250V, it's suitable for a wide range of applications. Constructed with brass contacts and polyester housing, it offers durability and performance. Featuring a pitch of 3.96mm and a low profile, it's ideal for space-constrained designs. RoHS compliant and lead-free solder capable, this connector meets environmental standards. Whether for industrial machinery or consumer electronics, the KK 396 Header is the perfect choice for your connectivity needs.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 15-31-1066 | 2.36mm Diameter Standard .093" Pin and Socket Header, Vertical, Solid Pin Style, with Beveled Plastic Peg, 6 Circuits | ![]() |
| Molex 22-03-2061 | KK 254 Wire-to-Board Header, Single Row, Vertical, 6 Circuits, PA Polyamide Nylon, Tin (Sn) Plating | ![]() |
| Molex 22-10-2031 | KK 254 Wire-to-Board Header, Single Row, Vertical, 3 Circuits, PA Polyamide Nylon, Gold (Au) Plating | ![]() |
| Molex 22-11-2032 | KK 254 Solid Header, Vertical, with Friction Lock, 3 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | ![]() |
| Molex 22-11-2042 | KK 254 Solid Header, Vertical, with Friction Lock, 4 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | ![]() |
| Molex 22-11-2122 | KK 254 Solid Header, Vertical, with Friction Lock, 12 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | ![]() |
| Molex 22-23-2031 | KK 254 Solid Header, Vertical, with Friction Lock, 3 Circuits, 2.54µm Matte Tin (Sn) Plating, 3.56mm Tail Length | ![]() |
| Molex 26-61-4020 | KK 396 Header, Vertical, Friction Lock, 2 Circuits, Gold (Au) Plating | ![]() |
| Molex 26-61-4030 | KK 396 Header, Vertical, Friction Lock, 3 Circuits, Gold (Au) Plating | ![]() |
| Molex 26-61-4120 | KK 396 Header, Vertical, Friction Lock, 12 Circuits, Gold (Au) Plating | ![]() |
| Molex 26-61-5030 | KK 396 Header, Right-Angle with Friction Lock, 3 Circuits, Gold (Au) Plating | ![]() |
| Molex 26-61-5040 | KK 396 Header, Right-Angle with Friction Lock, 4 Circuits, Gold (Au) Plating | ![]() |
| Molex 39-00-0022 | SPOX Crimp Terminal, 24-18 AWG, Phosphor Bronze, Bag | ![]() |
| Molex 39-01-4030 | Mini-Fit Jr. Receptacle Housing, Single Row, 3 Circuits, UL 94V-2, Natural | ![]() |
| Molex 43045-0214 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 2 Circuits, with PCB Polarizing Peg, 0.76µm Gold Plating, Glow-Wire Capable, Black | ![]() |
| Molex 70543-0107 | 2.54mm Pitch SL Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 3.30mm Tail Length, 3 Circuits, 0.76µm Gold (Au) Selective Plating, Matte Tin (Sn) Tail Plating | ![]() |
| Molex 87831-0820 | 2.00mm Pitch, Milli-Grid PCB Header, Dual Row, Vertical, Through Hole, Shrouded, 8 Circuits, 0.38µm Gold (Au) Plating, 2.50mm Tail Length, Dual Side Slots, Center Polarization, Tube | ![]() |
| Molex 87832-1420 | 2.00mm Pitch, Milli-Grid PCB Header, Dual Row, Vertical, Surface Mount, Shrouded, 14 Circuits, 0.38µm Gold (Au) Plating, Dual Side Slots, Dual Friction Locks, Center Polarization, with Pegs, Tube | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||


