| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 22-11-2022 |
| Gender: | Male |
| Number of Contacts: | 2 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Pitch: | 2.54 mm |
| Shrouded: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 4 A |
| Voltage Rating: | 500 V |
| Operating Temperature: | -40 to 80 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL22-11-2022 |
22-11-2022
Specifications
Detailed Description
Introducing the 22-11-2022, a high-quality KK 254 Solid Header designed for reliable board-to-wire connections. This vertical header features a friction lock mechanism, ensuring secure mating with cables. With 2 gold-plated (Au) contacts, it guarantees excellent conductivity and corrosion resistance. The natural white nylon housing is durable and flame-retardant, meeting stringent safety standards. Rated for 4 A and 500 V, this header is suitable for various power and signal applications. Its straight body orientation and 2.54 mm pitch make it compatible with standard PCB layouts. UL and CSA certified, it assures compliance with industry regulations. Whether used in consumer electronics or industrial machinery, the 22-11-2022 offers dependable performance in demanding environments. Rest assured, this product is RoHS compliant, reflecting our commitment to environmental responsibility. Elevate your connectivity solutions with this premium KK 254 header.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 15-38-1024 | 2.54mm Pitch C-Grid Shunt Terminal Housings, Overall Tin (Sn), 2 Circuits, with Open End |  |
 | Molex 22-03-5035 | 2.50mm Pitch, Mini-SPOX PCB Header, Single Row, Vertical, Through Hole, Tin Plating, 3 Circuits, 3.50mm PC Tail Length | |
 | Molex 22-03-5065 | 2.50mm Pitch, Mini-SPOX PCB Header, Single Row, Vertical, Through Hole, Tin Plating, 6 Circuits, 3.50mm PC Tail Length | |
 | Molex 22-11-2032 | KK 254 Solid Header, Vertical, with Friction Lock, 3 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-11-2042 | KK 254 Solid Header, Vertical, with Friction Lock, 4 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-11-2052 | KK 254 Solid Header, Vertical, with Friction Lock, 5 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-11-2062 | KK 254 Solid Header, Vertical, with Friction Lock, 6 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-11-2072 | KK 254 Solid Header, Vertical, with Friction Lock, 7 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-11-2102 | KK 254 Solid Header, Vertical, with Friction Lock, 10 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-11-2142 | KK 254 Solid Header, Vertical, with Friction Lock, 14 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-23-2041 | KK 254 Solid Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating | |
 | Molex 26-48-1026 | KK 396 Breakaway Header, Right-Angle with Friction Lock, 2 Circuits, Tin (Sn) Plating | |
 | Molex 26-61-4020 | KK 396 Header, Vertical, Friction Lock, 2 Circuits, Gold (Au) Plating | |
 | Molex 39-28-9068 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 6 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Natural | |
 | Molex 50-37-5033 | 2.50mm Pitch, Mini-SPOX Receptacle Crimp Housing, Single Row, Friction Lock, 3 Circuits, Natural | |
 | Molex 50-37-5063 | 2.50mm Pitch, Mini-SPOX Receptacle Crimp Housing, Single Row, Friction Lock, 6 Circuits, Natural | |
 | Molex 70545-0036 | 2.54mm Pitch SL Header, Single Row, 3.05mm Pocket, Vertical, Shrouded, with Press-Fit Plastic Peg, 2 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) Tail Plating | |
 | Molex 90120-0762 | 2.54mm Pitch C-Grid III Header, Single Row, Vertical, 2 Circuits, 0.38µm Gold (Au) Selective Plating | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 09/01/2019 | 507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
| 07/01/2019 | 507163 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download | |||
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||
| 03/18/2016 | 500669 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes and quantities. No changes will be made to the product as a result of the packaging change. | Download | |||
| 02/01/2012 | GCM 10523658 - Changing selected Mini-Fit and KK Product that were Overall Gold Plated Terminals to Select Gold, or Gold only in the contact area, and Matte Tin in solder tail area (changing solder tails from Overall Gold Plating to Matte Tin Plating). | Download | |||
| 02/01/2012 | GCM 10534789 - Plating changed from all over Gold Plating to Selective Gold Plating. | N/A | |||
Availability
In Stock:
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Stock Location:
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Factory Stock:
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Unit Of Measure:
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |