172050-3064

ICC Number:MOL172050-3064
Manufacturer:Molex
Manufacturer Number:172050-3064
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

EdgeLine+ ESP Vertical Connector, 15 Gbps, 0.75mm Pitch, 1.57mm PCB Thickness, 40.0A Power Module, 64 Circuits, 2 Power Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 172050-3064
Housing Material:High Temperature Plastic
Number of Contacts:64
Contact Material:Copper Alloy
Contact Plating:Gold
Pitch:0.75 mm
Current Rating:1.5 A, 40 A
Voltage Rating:250 V
Card Thickness:1.57 mm
Operating Temperature:-40 to 105 °C
Mounting Angle:Straight
Mounting Type:Surface Mount
SKU:MOL172050-3064

Detailed Description

The Molex EdgeLine+ ESP Vertical Connector, with a SKU of 172050-3064, is a high-performance connectivity solution designed for demanding applications. With a data rate of 15 Gbps and 64 circuits, including 2 power circuits, this connector ensures reliable power and signal transmission. Featuring a straight body orientation and a pitch of 0.75mm, it offers efficient PCB to edge card connections. Constructed with a thermoplastic housing and copper alloy contacts plated with gold over nickel, it guarantees durability and excellent conductivity. With UL and CSA agency certifications, as well as RoHS compliance, this connector meets stringent quality and environmental standards. Suitable for a wide range of industries, from telecommunications to industrial automation, the Molex EdgeLine+ ESP Connector is the ideal choice for high-speed and high-power applications.