172050-3064

MOL172050-3064
Heilind Number:MOL172050-3064
Manufacturer:Molex
Manufacturer Number:172050-3064
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

EdgeLine+ ESP Vertical Connector, 15 Gbps, 0.75mm Pitch, 1.57mm PCB Thickness, 40.0A Power Module, 64 Circuits, 2 Power Circuits

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Card Edge Connectors
Manufacturer:Molex
Manufacturer Part Number:Molex 172050-3064
Color:Black
Series:172050 - EdgeLine
Amperage:1.5 A, 40 A
Connector Type:EdgeLine
Housing Material:Thermoplastic
Number of Contacts:64
Termination Method:Surface Mount
Contact Material:Copper Alloy
Contact Plating:Gold Over Nickel
Body Orientation:Straight
Pitch:.75 mm
Voltage:250 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Component Type:Edgecard to PCB
Data Rate:12.5 - 20 Gb/s
Packaging:Tube
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold over Nickel
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:64
Mating Cycles:200
PCB Locator:Yes
PCB Retention:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.79 mm
CSA Agency Certification:LR19980
UL Agency Certification:E29179
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):010
Max. Cycles at Max. Process Temperature:002
Termination Pitch:.75 mm
Power and Signal Configuration:64 s - 0 p
Edge Card Thickness:1.57 mm
Standards Met:General
Part Aliases:1720503064
SKU:MOL172050-3064

Detailed Description

The Molex EdgeLine+ ESP Vertical Connector, with a SKU of 172050-3064, is a high-performance connectivity solution designed for demanding applications. With a data rate of 15 Gbps and 64 circuits, including 2 power circuits, this connector ensures reliable power and signal transmission. Featuring a straight body orientation and a pitch of 0.75mm, it offers efficient PCB to edge card connections. Constructed with a thermoplastic housing and copper alloy contacts plated with gold over nickel, it guarantees durability and excellent conductivity. With UL and CSA agency certifications, as well as RoHS compliance, this connector meets stringent quality and environmental standards. Suitable for a wide range of industries, from telecommunications to industrial automation, the Molex EdgeLine+ ESP Connector is the ideal choice for high-speed and high-power applications.