172050-3064
EdgeLine+ ESP Vertical Connector, 15 Gbps, 0.75mm Pitch, 1.57mm PCB Thickness, 40.0A Power Module, 64 Circuits, 2 Power Circuits
Part Aliases: Molex 1720503064
The Molex EdgeLine+ ESP Vertical Connector, with a SKU of 172050-3064, is a high-performance connectivity solution designed for demanding applications. With a data rate of 15 Gbps and 64 circuits, including 2 power circuits, this connector ensures reliable power and signal transmission. Featuring a straight body orientation and a pitch of 0.75mm, it offers efficient PCB to edge card connections. Constructed with a thermoplastic housing and copper alloy contacts plated with gold over nickel, it guarantees durability and excellent conductivity. With UL and CSA agency certifications, as well as RoHS compliance, this connector meets stringent quality and environmental standards. Suitable for a wide range of industries, from telecommunications to industrial automation, the Molex EdgeLine+ ESP Connector is the ideal choice for high-speed and high-power applications.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 172050-3064 |
Color: | Black |
Series: | 172050 - EdgeLine |
Amperage: | 1.5 A, 40 A |
Connector Type: | EdgeLine |
Housing Material: | Thermoplastic |
Number of Contacts: | 64 |
Termination Method: | Surface Mount |
Contact Material: | Copper Alloy |
Contact Plating: | Gold Over Nickel |
Body Orientation: | Straight |
Pitch: | .75 mm |
Voltage: | 250 V AC/DC |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Component Type: | Edgecard to PCB |
Data Rate: | 12.5 - 20 Gb/s |
Packaging: | Tube |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Gold over Nickel |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 64 |
Mating Cycles: | 200 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | .762 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 2.79 mm |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 010 |
Max. Cycles at Max. Process Temperature: | 002 |
Termination Pitch: | .75 mm |
Power and Signal Configuration: | 64 s - 0 p |
Edge Card Thickness: | 1.57 mm |
Standards Met: | General |
Part Aliases: | 1720503064 |
SKU: | MOL172050-3064 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
12/26/2022 | 512555 - Change supplier. Current Vendor Kemper Stopped producing C42500 metal alloy we must qualify new source Boway to keep Production running metal alloys are not changed Boway is one of Local metal supplier in china. | Download |