2302785-1
RA PLUG ASSY,7ROW,CENTER,VPX,MG RT3
Part Aliases: TE Connectivity null
The RA PLUG ASSY is a high-performance connector designed for use in aerospace, defense, and marine applications. Featuring 112 positions in a 7-row configuration, this VPX connector offers reliable signal transmission with a low impedance of 100 Ω. Each row is spaced at 1.35 mm, ensuring efficient board-to-board connections. Constructed with durable LCP-GF housing material, it is suitable for harsh environments. The through-hole press-fit termination method guarantees secure attachment to the PCB. With a mating alignment system and keyed interface, installation is quick and easy. This connector is not sealable and is not RoHS compliant. Perfect for high-speed signal applications, the RA PLUG ASSY is a critical component in demanding operating environments.
Details
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2302785-1 |
| Series: | MULTIGIG RT 3 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Pitch: | .075 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Number of Pairs: | 32 |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Circuit Application: | Signal |
| Sealable: | No |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Number of Signal Positions: | 8 |
| Connector System: | Board to Board |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | No |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Unguided |
| Number of Ground Positions: | 40 |
| Signal Arrangement: | Differential |
| Part Aliases: | null 2302785-1 |
| SKU: | AMP2302785-1 |
Frequently bought together
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download |
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download |