74441-0001
0.80mm Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, Right-Angle, Surface Mount, 20 Circuits, 0.38?m Gold (Au)
Part Aliases: Molex 0744410001
The Molex 74441-0001 High Speed SFP/SFP Plus/SFP Connector, a versatile and reliable solution for your high-speed connectivity needs. This black connector features a right angle body orientation and is designed for surface mount termination, making it ideal for space-constrained applications. With 20 contacts loaded in a 2-row configuration, it offers efficient signal transmission with a pitch of 0.8mm. The contacts are made of high-performance alloy with gold plating, ensuring excellent conductivity and durability. Rated for 30V AC/DC, this connector operates reliably in a wide temperature range from -40 to 85°C. It is RoHS compliant and lead-free process capable, making it a sustainable choice for your designs. Trust the Molex 74441-0001 connector for high-speed performance and durability in your applications.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 74441-0001 |
| Color: | Black |
| Series: | 74441 - SFP - SFP Plus - SFP |
| Amperage: | .5 A |
| Connector Type: | SFP, SFP Plus |
| Gender: | Receptacle |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Right Angle |
| Keying: | Yes |
| Component Type: | Receptacle |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Module to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | .8 mm |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0744410001 |
| Contact Detail: | 20 |
| SKU: | MOL74441-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2023 | 513862 - Packaging Method/Quantity Changing. In order to internal process improve & improve quality, change the SPQ/box is from 960pcs to 1920pcs. | Download |
| 11/27/2022 | 512025 - Change To Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Molex has identified a shortage risk of resin supply which would create a challenge to fulfill orders therefore a new LCP resin has been identified for relative product. | Download |
| 03/15/2022 | 511440 - Equipment/ production transfer or rearrangement. molex will add manufacture source to run the parts at local qualified assembly vendors. regardless of location production conditions will remain the same meaning the same component from the same source the same process monitoring system and the same quality control plan. | Download |
| 02/17/2020 | 508159 - Production Location Change. Molex Chengdu will add local qualified vendor as stamping source, then will ve able to run terminal production in both locations of Molex Chengdu & local qualified stamping vendor. No impact to fit, form or function. | Download |
| 02/23/2019 | 505857 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |
| 05/10/2017 | 501397 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
| 01/03/2015 | GCM 10657719 - Manufacturing Process Change. | Download |
| 08/15/2014 | GCM 10642993 - Outsourcing Component Or Subcomponent. | Download |
| 08/03/2014 | GCM 10640994 - New, Modified, Or Replacement Tooling. The purpose of the change is new stamping die build from 1rowx1up to 2rowx1up and the reason of change is for supporting customer increasing monthly demand and mitigate constraint of press machine. No form, fit, function impacted on products. | Download |