10-89-7200
2.54mm Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 20 Circuits, 0.76
Part Aliases: Molex 0010897200 Molex A-70280-0090
The 10-89-7200 is a high-performance PCB pin header connector from the C-Grid 70280 series, featuring 20 contacts in a 2-row configuration for efficient board-to-board or wire-to-board connections. With a compact 2.54mm pitch and straight body orientation, this connector is designed for space-saving vertical mounting in your electronic assemblies. Constructed with a durable high-temperature thermoplastic housing and copper alloy contacts, it offers reliable performance in harsh environments. Rated for 3A and 250V, with gold contact plating for enhanced conductivity, this connector ensures secure signal transmission. It is UL and CSA certified, RoHS compliant, and suitable for lead-free soldering processes, making it ideal for a wide range of applications in electronics and telecommunications.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 10-89-7200 |
| Color: | Black |
| Series: | 70280 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Copper Alloy |
| Body Orientation: | Straight |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 2.79 mm |
| Packaging: | Bag |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .813 µm |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 50 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 2.032 µm |
| Polarized to Mate: | No |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Make First / Break Last: | No |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0010897200 A-70280-0090 |
| SKU: | MOL10-89-7200 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 03/31/2020 | 507616 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |