50394-8052
Milli-Grid Crimp Terminal, Female, 0.76
Part Aliases: Molex 0503948052
The 50394-8052 Milli-Grid Crimp Terminal, a high-performance female connector designed for precision applications. With a current rating ranging from 0.5 to 2 A and a voltage tolerance of 125 V, this terminal is perfect for signal circuitry. Constructed from durable copper alloy with nickel plating, it ensures reliable conductivity and corrosion resistance. The gold-plated mating area guarantees low contact resistance, while the crimp or compression termination method offers secure wire connectivity. Suitable for 24 to 30 AWG wires with a maximum insulation diameter of 1.4 mm, this terminal is versatile and easy to install. RoHS compliant and in stock for immediate shipping, it is a must-have component for your connectivity needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8052 |
| Series: | 50394 - Milli-Grid |
| Amperage: | 1.5 A, 1 A, 2 A, .5 A |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Voltage: | 125 V |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948052 |
| SKU: | MOL50394-8052 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download |