43650-0815
Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 8 Circuits, with PCB Polarizing Peg, Tin, Glow-Wire Capable, Black
Part Aliases: Molex 0436500815
The Molex Micro-Fit 3.0 Vertical Header, part number 43650-0815. This single-row connector features 8 circuits with a 3.00mm pitch, designed for through-hole - kinked pin termination on printed circuit boards. With a current rating of 8.5A and a voltage of 600V, it ensures reliable power delivery. The connector is constructed of high temperature thermoplastic, suitable for operating in a wide range of environments from -40 to 105°C. Tin contact mating area plating with a thickness of 2.54µm offers excellent conductivity and durability. PCB polarizing pegs and retention ensure secure assembly, while its glow-wire capability guarantees safety. RoHS compliant and lead-free process compatible, this connector is ideal for various wire-to-board applications.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43650-0815 |
| Color: | Black |
| Series: | 43650 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 8 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Kinked Pin |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | Yes |
| Mated Height: | 17.27 mm |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0436500815 |
| SKU: | MOL43650-0815 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download |
| 06/07/2024 | 514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 02/26/2021 | 509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & Quality | Download |
| 12/31/2020 | 508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier. | Download |
| 07/01/2017 | 502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |