43650-0500
Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 5 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Glow-Wire Capable, Black
Part Aliases: Molex 0436500500
The Micro-Fit 3.0 Right-Angle Header, a high-performance connectivity solution for your PCB applications. With a compact 3.00mm pitch and featuring a single row design, this header is meticulously engineered for precision and reliability. Boasting 5 circuits and equipped with a convenient snap-in plastic peg PCB lock, it ensures secure connections in any setup. The tin contact mating area plating, along with glow-wire capability, guarantees enhanced safety and durability. Crafted from black high-temperature thermoplastic, this header is not only visually sleek but also operates flawlessly in a wide temperature range from -40 to 105 °C. With RoHS compliance and lead-free process capability, it meets stringent environmental standards. Trust in the Micro-Fit 3.0 for seamless wire-to-board or wire-to-wire connections in various electronic applications. Available for immediate shipping.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43650-0500 |
| Color: | Black |
| Series: | 43650 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 5 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Right Angle |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 5 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | Yes |
| Mated Height: | 6.98 mm |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0436500500 |
| SKU: | MOL43650-0500 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 02/26/2021 | 509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & Quality | Download |
| 12/31/2020 | 508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier. | Download |
| 07/01/2017 | 502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |