43650-0401

Heilind Number:MOL43650-0401
Manufacturer:Molex
Manufacturer Number:43650-0401
Datasheet:Packaging Specifications
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 4 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Glow-Wire Capable, Black

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 43650-0401
Color:Black
Series:43650
Amperage:8.5 A
Connector Type:Micro-Fit 3.0
Number of Contacts:4
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Right Angle
Pitch:3 mm
Voltage:600 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:4
Mating Cycles:30
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:2.540 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:Yes
Mated Height:6.98 mm
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Shroud Type:Fully
Product Name:Micro-Fit 3.0
Material Flammability Standard:94V-0
Part Aliases:0436500401
SKU:MOL43650-0401

Detailed Description

The Micro-Fit 3.0 Right-Angle Header is a high-performance connectivity solution designed for seamless PCB integration. With a compact 3.00mm pitch and featuring a single row configuration, this header accommodates 4 circuits with precision. The inclusion of a snap-in plastic peg PCB lock ensures secure mating, while its gold contact mating area plating (0.381µm) guarantees reliable conductivity. Engineered for durability, this header boasts a high-temperature thermoplastic construction, with a wide operating temperature range of -40 to 105°C. Its tin contact termination plating (2.540µm) and compatibility with lead-free SMC and Wave soldering processes make it ideal for various applications. RoHS compliant and glow-wire capable, the Micro-Fit 3.0 header guarantees both performance and safety in demanding environments.