39-30-1180

Heilind Number:	MOL39-30-1180
Manufacturer:	Molex
Manufacturer Number:	39-30-1180
Datasheet:	Application Specification
ECAD Model:

Description:

Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, Nylon 6/6 94V-2, 2.54µm Matte Tin (Sn) Plating, Natural

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Specifications

Attribute	Value
Product Category:	PC Board Pin & Receptacle Connectors PCB Pin Headers
Manufacturer:	Molex
Manufacturer Part Number:	Molex 39-30-1180
Color:	Natural
Series:	5569 - Mini-Fit Jr.
Amperage:	13 A
Connector Type:	Mini-Fit Jr.
Number of Contacts:	18
Number of Rows:	2
Termination Method:	Through Hole
Contact Material:	Brass
Body Orientation:	Right Angle
Pitch:	4.2 mm
Voltage:	600 V
Material:	Nylon
Orientation:	Right Angle
Keying:	No
Operating Temperature Range:	-40 - 105 °C
Contact Mating Area Plating:	Matte Tin
Contact Mating Area Plating Thickness:	2.54 µm
Number of Contacts Loaded:	18
Mating Cycles:	30
PCB Locator:	Yes
PCB Retention:	Yes
Polarized to PCB:	Yes
Contact Termination Plating Thickness:	2.540 µm
Polarized to Mate:	Yes
PCB Thickness (Recommended):	1.78 mm
Connector System:	Wire to Board
Contact Termination Plating:	Matte Tin
Maximum Solder Process Temperature:	240 °C
Lead Free Process Capability:	WAVE
Duration at Max. Process Temperature (seconds):	005
Max. Cycles at Max. Process Temperature:	001
Termination Pitch:	4.2 mm
Glow Wire Capable:	No
Guide to Mating Part:	No
Lock to Mating Part:	Yes
Stackable:	No
Surface Mount Compatible:	No
Breakaway:	No
Make First / Break Last:	No
Shroud Type:	Fully
Material Flammability Standard:	94V-2
Part Aliases:	0039301180 5569-18A2
SKU:	MOL39-30-1180

Detailed Description

Introducing the 39-30-1180, a Mini-Fit Jr. Header designed for high-performance connectivity in electronic applications. This dual-row header features a right-angle configuration with a convenient snap-in plastic peg PCB lock, ensuring secure and reliable connections. With 18 circuits and made from durable Nylon 6/6 94V-2 material, it offers excellent versatility and safety. The header is plated with 2.54µm Matte Tin (Sn) for enhanced conductivity and corrosion resistance. Operating at a maximum of 13 A and 600 V, it is suitable for power and signal transmission. Its brass contact material and through-hole termination method guarantee robust performance, even in demanding environments. RoHS compliant and lead-free process capable, this header meets high industry standards for environmental responsibility. Perfect for wire-to-board applications, the 39-30-1180 is a reliable and efficient solution for your connectivity needs.

Frequently Bought Together

Product	Part #	Description	Stock
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	Molex 39-30-1060	Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits, Nylon 6/6 94V-2, 2.54µm Matte Tin (Sn) Plating, Natural
	Molex 39-30-1080	Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, Nylon 6/6 94V-2, 2.54µm Matte Tin (Sn) Plating, Natural
	Molex 39-30-1120	Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 12 Circuits, Nylon 6/6 94V-2, 2.54µm Matte Tin (Sn) Plating, Natural
	Molex 39-30-1160	Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, Nylon 6/6 94V-2, 2.54µm Matte Tin (Sn) Plating, Natural
	Molex 39-30-3045	Mini-Fit Jr. Header, Single Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 4 Circuits, PA Polyamide Nylon 6/6, 94V-2, Tin (Sn) Plating
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	Molex 43045-0818	Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 8 Circuits, with Solder Tab, Tin, Glow-Wire Capable, Black
	Molex 52271-1469	Easy-On FFC/FPC Connector, 1.00mm Pitch, Slider Series, Right-Angle, Bottom Contact, 3.00mm Height, 14 Circuits, Gold Plating
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Product Change Notice

Effective Date	Description of Change	Download
12/31/2022	512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change	Download
03/01/2021	509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)	Download
07/01/2017	502703 - Equipment Transfer, Production Transfer or Rearrangement.	Download
01/19/2015	GCM 10653987 - Supplier Change.	Download