26-60-5020

ICC Number:	MOL26-60-5020
Manufacturer:	Molex
Manufacturer Number:	26-60-5020
Datasheet:	Datasheet
ECAD Model:

Description:

KK 396 Header, Right-Angle with Friction Lock, 2 Circuits, Tin (Sn) Plating

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Specifications

Attribute	Value
Product Category:	PCB Connectors PCB Headers & Receptacles
Manufacturer:	Molex
Manufacturer Part Number:	Molex 26-60-5020
Gender:	Male
Number of Contacts:	2
Number of Rows:	1
Contact Material:	Brass
Contact Plating:	Tin
Pitch:	3.96 mm
Shrouded:	Yes
Flammability Rating:	UL 94V-0
Current Rating:	7 A
Voltage Rating:	250 V
Mounting Angle:	Right Angle
Mounting Type:	Through Hole
PCB Connector Type:	PCB Mount Header
SKU:	MOL26-60-5020

Detailed Description

Introducing the 26-60-5020, a versatile KK 396 Right-Angle Header with Friction Lock, perfect for secure board-to-wire connections in electronic applications. This two-circuit connector features durable brass contacts with tin plating, offering reliable conductivity and corrosion resistance. With a low profile design and a 3.96mm pitch, it's ideal for space-constrained PCB layouts. Rated for 7A and 250V, it ensures safe power transmission. The polyester housing is both durable and flame-retardant, meeting RoHS compliance for environmental responsibility. UL and CSA certified, this connector guarantees quality and safety. Perfect for wire-to-board applications, it's a dependable choice for your connectivity needs.

Frequently Bought Together

Product	Part #	Description	Stock
	Molex 02-06-5102	1.57mm Diameter, Standard .062 Pin and Socket Crimp Terminal, Female, with 0.76
	Molex 02-06-6102	1.57mm Diameter, Standard .062 Pin and Socket Crimp Terminal, Series 1560, Male, with .76
	Molex 09-50-3021	KK 3.96mm Crimp Housing, Friction Ramp, 2 Circuits, Natural
	Molex 171813-0002	KK 396 RPC Vertical Header, 3.96mm Pitch, Friction Lock, Reflowed Matte Tin (Sn) Plating, 17.02mm Mating Pin Length, 2.37mm Tail Length, 2 Circuits
	Molex 171814-1002	KK 396 RPC Right-Angle Header, 3.96mm Pitch, Friction Lock, 0.38µm Gold (Au) Plating, 11.33mm Mating Pin Length, 2.54mm Tail Length, 2 Circuits
	Molex 22-05-3021	KK 254 Solid Header, Right-Angle, with Friction Lock, 2 Circuits, Matte Tin (Sn) Plating
	Molex 22-23-2041	KK 254 Solid Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating
	Molex 22-28-4060	KK 254 Breakaway Header, Vertical, 6 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm
	Molex 26-60-4020	KK 396 Header, Vertical, Friction Lock, 2 Circuits, Tin (Sn) Plating
	Molex 26-60-5030	KK 396 Header, Right-Angle with Friction Lock, 3 Circuits, Tin (Sn) Plating
	Molex 26-60-5040	KK 396 Header, Right-Angle with Friction Lock, 4 Circuits, Tin (Sn) Plating
	Molex 39-28-1043	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 4 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 39-29-9082	Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 8 Circuits, with Snap-in Plastic Peg PCB Lock, Tin, Natural
	Molex 39-30-1040	Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 4 Circuits, Nylon 6/6 94V-2, 2.54µm Matte Tin (Sn) Plating, Natural
	Molex 39-30-1062	Mini-Fit Jr. Header, Dual Row, Right-Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76Âµm Select Gold (Au) Plating
	Molex 42819-2212	10.00mm Pitch Mini-Fit Sr. Header, Single Row, Vertical, 1.57mm PCB Thickness, Tin (Sn) Plating, 2 Circuits, USE NYE LUBE ON MATING SURFACES
	Molex 43045-0600	Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Dual Row, 6 Circuits, with Snap-in Plastic Peg PCB Lock, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black
	Molex 70246-1601	2.54mm Pitch C-Grid Header, Low Profile, Dual Row, Vertical, Shrouded, 16 Circuits, 0.38µm Gold (Au) Selective Plating

Product Change Notice

Effective Date	Description of Change	Download
12/31/2022	512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change	Download
02/28/2022	511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.	Download
11/12/2021	510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date.	Download
03/01/2021	509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)	Download
03/15/2019	506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.	Download
07/01/2017	502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.	Download