| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 26-61-4100 |
| Gender: | Male |
| Number of Contacts: | 10 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold, Tin |
| Pitch: | 3.96 mm |
| Shroud Type: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 7 A |
| Voltage Rating: | 600 V |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL26-61-4100 |
26-61-4100
Specifications
Detailed Description
Introducing the 26-61-4100, a high-quality KK 396 Header designed for vertical, friction lock applications. Featuring 10 gold-plated (Au) circuits, this connector ensures reliable conductivity in a natural color. With a low amperage rating of 7 A, it is ideal for various electronic devices. The straight body orientation and through-hole termination method offer easy installation on PCBs with a pitch of 3.96 mm. Certified by CSA and UL agencies, this header guarantees safety and performance. Its polyester construction and matte tin contact termination make it durable and suitable for lead-free soldering processes. Perfect for wire-to-board connections, the 26-61-4100 is a versatile and dependable component for your PCB assembly needs. Rest assured, it is RoHS compliant, further emphasizing its quality and environmental responsibility. Elevate your connectivity solutions with this essential KK Connector Systems product.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 08-58-0126 | KK 396 Crimp Terminal 2578, 26-22 AWG, Bag, Phosphor Bronze, 0.38µm Selective Gold (Au) over Gold Flash | ![]() |
| Molex 09-50-3181 | KK 3.96mm Crimp Housing, Friction Ramp, 18 Circuits, Natural | ![]() |
| Molex 22-05-3041 | KK 254 Solid Header, Right-Angle, with Friction Lock, 4 Circuits, Matte Tin (Sn) Plating | ![]() |
| Molex 22-11-2062 | KK 254 Solid Header, Vertical, with Friction Lock, 6 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | ![]() |
| Molex 22-11-2072 | KK 254 Solid Header, Vertical, with Friction Lock, 7 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | ![]() |
| Molex 22-23-2081 | KK 254 Solid Header, Vertical, with Friction Lock, 8 Circuits, Tin (Sn) Plating | ![]() |
| Molex 39-01-2025 | Mini-Fit Jr. Receptacle Housing, Dual Row, 2 Circuits, UL 94V-0, Natural | ![]() |
| Molex 39-01-2045 | Mini-Fit Jr. Receptacle Housing, Dual Row, 4 Circuits, UL 94V-0, Natural | ![]() |
| Molex 39-28-1023 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 2 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural | ![]() |
| Molex 39-28-8240 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 24 Circuits, without Snap-in Plastic Peg PCB Lock, Tin, Natural | ![]() |
| Molex 39-31-0048 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 4 Circuits, without Snap-in Plastic Peg PCB Lock, Gold, Natural | ![]() |
| Molex 43650-0318 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 3 Circuits, with PCB Press-fit Metal Retention Clip, 1.52µm Matte Tin Plating, Glow-Wire Capable, Black | ![]() |
| Molex 43860-0006 | Modular Jack, Right-Angle, Low Profile, Inverted, Shielded, All Panel Grounding Tabs, 6/4 | ![]() |
| Molex 44476-1112 | Mini-Fit HCS Crimp Terminal, 20-18 AWG, Copper (Cu) Alloy, Tin (Sn) | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||


