Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 43650-0318 |
Color: | Black |
Series: | 43650 |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit 3.0 |
Number of Contacts: | 3 |
Number of Rows: | 1 |
Termination Method: | Through Hole - Kinked Pin |
Contact Material: | Brass |
Body Orientation: | Straight |
Pitch: | 3 mm |
Voltage: | 600 V |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 2.54 µm |
Number of Contacts Loaded: | 3 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | SMC and Wave |
Duration at Max. Process Temperature (seconds): | 030 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | Yes |
Mated Height: | 17.27 mm |
Stackable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit 3.0 |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0436500318 |
SKU: | MOL43650-0318 |
43650-0318
Heilind Number: | MOL43650-0318 |
Manufacturer: | Molex |
Manufacturer Number: | 43650-0318 |
Datasheet: | Packaging Specifications |
ECAD Model: |
Description:
Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 3 Circuits, with PCB Press-fit Metal Retention Clip, Tin, Glow-Wire Capable, Black
More >>Specifications
Detailed Description
The Micro-Fit 3.0 Vertical Header is a high-performance connector designed for reliable power and signal transmission in various electronic applications. With a compact 3.00mm pitch and featuring a single row of 3 circuits, this header is essential for space-constrained PCB layouts. The inclusion of a PCB press-fit metal retention clip ensures secure board attachment, while its tin plating and glow-wire capability guarantee enhanced safety. Crafted from high-temperature thermoplastic, it offers robust durability in harsh operating conditions ranging from -40 to 105 °C. Fully shrouded and polarized to the PCB, this connector guarantees proper mating orientation. RoHS compliant and lead-free solder compatible, the Micro-Fit 3.0 is the ideal choice for demanding wire-to-board applications.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download | |||
06/07/2024 | 514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable. | Download | |||
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download | |||
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download | |||
02/26/2021 | 509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & Quality | Download | |||
12/31/2020 | 508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier. | Download | |||
05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |