| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 22-29-2021 |
| Gender: | Male |
| Number of Contacts: | 2 |
| Number of Rows: | 1 |
| Contact Material: | Brass |
| Contact Plating: | Gold, Tin |
| Pitch: | 2.54 mm |
| Shrouded: | Yes |
| Flammability Rating: | UL 94V-0 |
| Current Rating: | 4 A |
| Voltage Rating: | 500 V |
| Operating Temperature: | -40 to 80 °C |
| Mounting Angle: | Straight |
| Mounting Type: | Through Hole |
| PCB Connector Type: | PCB Mount Header |
| SKU: | MOL22-29-2021 |
22-29-2021
Specifications
Detailed Description
The 22-29-2021 KK 254 Wire-to-Board Header offers reliable vertical connectivity with a friction lock feature, ideal for secure board-to-wire applications. With 2 gold-plated (Au) circuits, it ensures excellent signal transmission, while the natural white color and straight body orientation add to its versatility. Constructed with brass contacts and nylon material, it guarantees durability and a maximum voltage of 500 V. This through-hole termination header, with a pitch of 2.54 mm, is UL and CSA certified, meeting quality and safety standards. Perfect for PCB connectors in various industries, it is also RoHS compliant, making it a sustainable choice for your projects.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
 | Molex 22-01-3037 | KK 254 Crimp Housing, Friction Ramp with Polarizing Ribs, 3 Circuits, Natural |  |
 | Molex 22-11-2162 | KK 254 Solid Header, Vertical, with Friction Lock, 16 Circuits, 0.51µm Gold (Au) Plating, 3.56mm Tail Length | |
 | Molex 22-12-2024 | KK 254 Solid Header, Right-Angle, with Friction Lock, 2 Circuits, 0.51µm Gold (Au) Plating | |
 | Molex 22-29-2031 | KK 254 Header, Vertical, Square Pin, Friction Lock, 3 Circuits, 7.50mm Mating Pin Length, 3.56mm Tail Length, 0.51µm Gold (Au) Plating | |
 | Molex 22-29-2041 | KK 254 Wire-to-Board Header, Vertical, with Friction Lock, 4 Circuits, Gold (Au) Plating | |
 | Molex 22-29-2061 | KK 254 Header, Vertical, Square Pin, Friction Lock, 6 Circuits, 7.50mm Mating Pin Length, 3.56mm Tail Length, 0.51µm Gold (Au) Plating | |
 | Molex 26-60-4040 | KK 396 Header, Vertical, Friction Lock, 4 Circuits, Tin (Sn) Plating | |
 | Molex 26-60-4060 | KK 396 Header, Vertical, Friction Lock, 6 Circuits, Tin (Sn) Plating | |
 | Molex 34690-0200 | Stac64 Vertical Header Assembly, 20 Circuits, Polarization A, Black, Tray | |
 | Molex 39-29-0023 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 2 Circuits, without Snap-in Plastic Peg PCB Lock, Gold, Natural | |
 | Molex 39-29-6048 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 4 Circuits, without Snap-in Plastic Peg PCB Lock, Gold, Natural | |
 | Molex 39-29-6088 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 8 Circuits, without Snap-in Plastic Peg PCB Lock, Gold, Natural | |
 | Molex 39-30-2031 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Single Row, 3 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Natural | |
 | Molex 39-30-2042 | Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Single Row, 4 Circuits, with Snap-in Plastic Peg PCB Lock, Gold, Natural | |
 | Molex 501331-0607 | 1.00mm Pitch, Pico-Clasp PCB Header, Single Row, Vertical, Surface Mount, Tin Plated, Inner Positive Lock, 6 Circuits, Natural | |
 | Molex 87832-1420 | 2.00mm Pitch, Milli-Grid PCB Header, Dual Row, Vertical, Surface Mount, Shrouded, 14 Circuits, 0.38µm Gold (Au) Plating, Dual Side Slots, Dual Friction Locks, Center Polarization, with Pegs, Tube | |
 | Molex 87834-0619 | 2.54mm Pitch C-Grid Header, Dual Row, Low Profile, Vertical, Shrouded, 6 Circuits, 0.13µm Gold (Au) Plating, Black, without PCB Locator, without End Window, Center Polarization Slot, Lead-Free | |
 | Molex 90131-0765 | 2.54mm Pitch C-Grid III Header, Dual Row, Vertical, 10 Circuits, 0.38µm Gold (Au) Selective Plating | |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download | |||
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download | |||
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download | |||
| 11/30/2020 | 509221 - Retraction of PCN 506276. retraction of DU min & MLQ Min qty update for kk part numbers | Download | |||
| 09/01/2019 | 507009 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download | |||
| 04/25/2019 | 506276 - Packaging Method/Quantity Changing. The part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download | |||
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download | |||
| 02/01/2012 | GCM 10523658 - Changing selected Mini-Fit and KK Product that were Overall Gold Plated Terminals to Select Gold, or Gold only in the contact area, and Matte Tin in solder tail area (changing solder tails from Overall Gold Plating to Matte Tin Plating). | Download | |||
| 02/01/2012 | GCM 10534789 - Plating changed from all over Gold Plating to Selective Gold Plating. | N/A | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |