15-91-7030

Heilind Number:MOL15-91-7030
Manufacturer:Molex
Manufacturer Number:15-91-7030
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.38

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 15-91-7030
Color:Black
Series:70634
Amperage:3 A
Connector Type:SL
Number of Contacts:3
Number of Rows:1
Termination Method:Surface Mount
Contact Material:Brass, Phosphor Bronze
Body Orientation:Right Angle
Pitch:2.54 mm
Voltage:250 V
Material:High Temperature Thermoplastic
Orientation:Right Angle
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Number of Contacts Loaded:3
Mating Cycles:50
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:1.905 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Glow Wire Capable:No
Lock to Mating Part:Yes
Stackable:No
Breakaway:No
Shroud Type:Fully
Product Name:SL
Material Flammability Standard:94V-0
Part Aliases:0015917030 70634-0142
SKU:MOL15-91-7030

Detailed Description

Introducing the SL Series 70634 PCB Pin Header, a reliable and high-performance connector designed for wire-to-board applications. With a low amperage rating of 3A and featuring 3 gold-plated contacts, this black right-angle header ensures secure and efficient power and signal transmission. Constructed from durable high-temperature thermoplastic and boasting a voltage rating of 250V, it guarantees reliable operation even in demanding environments. Its surface-mount termination method and PCB locator and retention options make for easy and secure installation. RoHS compliant and lead-free reflow solder process capable, the SL Series 70634 is the ideal choice for your high-speed and high-density connectivity needs.