08-70-0106
Board-In Crimp Terminal , Series 5298, Male, with Tin Insulation Diameter, Reel Packaged
Part Aliases: Molex 0008700106 Molex 5298T
The 08-70-0106, a high-quality Board-In Crimp Terminal from Series 5298. This male connector features Tin insulation, making it ideal for signal applications. With a brass contact material and Tin plating, it ensures reliable conductivity. Designed for wire sizes 22 AWG to 18 AWG, it offers versatile compatibility. The reel packaging provides convenience and organization. RoHS compliant and with a contact termination plating thickness of .889 µm, this connector guarantees both performance and environmental responsibility.Upgrade your wire-to-board connections with the 08-70-0106.
Details
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 08-70-0106 |
| Series: | 5298 - Board-in Stand Alone Terminal |
| Connector Type: | Board-in Stand Alone Terminal |
| Gender: | Male |
| Termination Method: | Crimp or Compression |
| Contact Material: | Brass |
| Contact Plating: | Tin |
| Packaging: | Reel |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | .889 µm |
| Contact Termination Plating Thickness: | .889 µm |
| Wire Size: | 18 AWG, 20 AWG, 22 AWG |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Wire Insulation Diameter: | 1.7 - 3.05 mm |
| Part Aliases: | 0008700106 5298T |
| SKU: | MOL08-70-0106 |
Frequently bought together
Compliance
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 08/01/2023 | 513562 - Equipment Transfer, Production Transfer or Rearrangement. 5298, 50125 product will be transferred from Japan vendor to Ansan plant in Korea for the productivity improvement & stable delivery performance. To better serve our customers and leverage our global manufacturing footprint. | Download |