08-56-0106
KK 396 Crimp Terminal 2478, 18-24 AWG, Bag, Brass, 0.51
Part Aliases: Molex 0008560106 Molex 2478-1-(550)L
The Molex KK 396 Crimp Terminal 2478 for reliable wire-to-board connections. Designed for 18-24 AWG wires, this female terminal is housed in a durable brass bag, ensuring longevity and secure performance. With a contact material of brass and gold plating, it guarantees excellent conductivity, making it ideal for power applications. The gold-plated contact mating area further enhances its reliability. Featuring a low profile and easy crimp or compression termination method, this terminal is versatile and user-friendly. RoHS compliant and with a wire insulation diameter of 2.79mm, it meets industry standards for environmental responsibility and performance. The Molex KK 396 is a trusted solution for your connectivity needs.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 08-56-0106 |
Series: | 2478 - KK 396 - KK 508 |
Connector Type: | KK 396, KK 508 |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Brass |
Contact Plating: | Gold |
Circuit Application: | Power |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .381 µm |
Contact Termination Plating Thickness: | .051 µm |
Wire Size: | 18 AWG, 20 AWG, 22 AWG, 24 AWG |
Connector System: | Wire to Board |
Contact Termination Plating: | Gold |
Wire Insulation Diameter: | 2.79 mm |
Part Aliases: | 0008560106 2478-1-(550)L |
SKU: | MOL08-56-0106 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
11/23/2021 | 510765 - Change to Product. We observed different terminal retention force for Phosphor Bronze & brass terminal, so updated the PS with correct requirement. No impact to fit form or function. | Download |
03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |