969973-7

ICC Number:AMP969973-7
Manufacturer:TE Connectivity
Manufacturer Number:969973-7
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2x7P HV100 REC. CON, SMD, GOLD, BLISTER

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 969973-7
Series:AMPMODU HV-100/HV-190
Amperage:3 A
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Straight
Pitch:.1 in, 2.54 mm
Contact Type:Socket
Row Spacing:.1 in, 2.54 mm
Package Quantity:600
Contact Amperage:3 A
Number of Positions:14
Mount Orientation:Vertical
GPL:281
Profile:Standard
Mating Entry Location:Bottom & Top
Packaging:Reel
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Retention:Without
PCB Contact Termination Area Plating:Tin
Connector Height:.244 in, 6.2 mm
Sealable:No
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:0337
Contact Layout:Inline
Stackable:Yes
ECCN:EAR99
Contact Protection Type:Closed Entry Housing
Application Solder Feature:Board Standoff
Connector Assembly Type:PCB Mount Receptacle
PCB Contact Termination Area Plating Thickness:2.5 µm
Part Aliases:969973-7
SKU:AMP969973-7

Detailed Description

The AMPMODU HV-100/HV-190 series offers high-density board-to-board connectivity with these straight socket connectors in a surface mount termination method. With a pitch of 2.54mm (.1 in) and two rows of 14 positions, these connectors are designed for efficient stacking and mezzanine applications. Rated for 3A of current, they feature gold-plated phosphor bronze contacts for reliable signal transmission. The LCP housing material ensures durability, while the standard profile and vertical mount orientation allow for easy integration onto PCBs. Each package contains 600 connectors, packaged on a reel for convenience. RoHS compliant and suitable for industrial use, the AMPMODU HV-100/HV-190 series is a reliable solution for high-density board stacking in electronic applications.