6-1734857-4

ICC Number:AMP6-1734857-4
Manufacturer:TE Connectivity
Manufacturer Number:6-1734857-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

PCI EXP STRADDLE 64P BLK 15u"

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 6-1734857-4
Housing Material:PA 9T GF
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Phosphor Bronze
Pitch:.039 in, 1 mm
Voltage:50 V AC
Package Quantity:60
Number of Positions:64
Housing Color:Black
Mount Orientation:Straddle Mount
GPL:144
Packaging:Box & Tray, Tray
Operating Temperature Range:-40 - 185 °F, -40 - 85 °C
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:15 µin
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.062 in, 1.57 mm
Connector Height:10 mm, .394 in
PCB Retention Type:Kinked
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:K370
Connector Length:1.535 in, 39 mm
Connector System:Board to Board
PCB Contact Termination Area Plating Finish:Matte
Connector Width:.346 in, 8.8 mm
Termination Post Tail Length:.16 in, 3.93 mm
PCB Contact Termination Area Plating Thickness:2.54 µm
Assembly Process Feature:Pick and Place Cover
Bus Type:PCI Express
Ejector:Without
Accepts PCB Thickness:.062 in, 1.57 mm
PCI Generation:II & III
Part Aliases:6-1734857-4
SKU:AMP6-1734857-4

Detailed Description

PCI Express Straddle Mount Card Edge Connector, featuring 64 positions for high-density connectivity. Constructed with durable PA 9T GF housing material in sleek black, this connector is designed for reliable performance. Surface mount termination method with phosphor bronze contacts and gold plating ensures optimal signal transmission. Operating at a voltage of 50 V AC, it is suitable for various applications. With a low profile of 10 mm, it offers space-saving board-to-board connectivity. RoHS compliant and suitable for pick and place assembly, this connector is ideal for high-speed data and device applications in harsh environments.