| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5-2337939-4 |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Pitch: | .039 in, 1 mm |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| GPL: | 144 |
| Packaging: | Box & Tray |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Retention Type: | SMT Hold-Down |
| Sealable: | No |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | K370 |
| Connector System: | Board to Board |
| ECCN: | EAR99 |
| Bus Type: | PCI Express |
| Ejector: | Without |
| Accepts PCB Thickness: | 1.57 mm |
| PCI Generation: | IV |
| Part Aliases: | 5-2337939-4 |
| SKU: | AMP5-2337939-4 |
5-2337939-4
| Heilind Number: | AMP5-2337939-4 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 5-2337939-4 |
| Datasheet: | 3D Model (STP) |
| ECAD Model: |
Specifications
Detailed Description
Introducing the 5-2337939-4, a high-performance PCIE GEN4 CON board-to-board connector designed for seamless surface mount integration. Featuring 164 gold-plated contacts with a low 30µin mating area thickness, this connector ensures reliable signal transmission in demanding applications. Constructed with a durable copper alloy contact material and nickel underplating, it offers enhanced longevity and robustness. The black housing, made of Mylar and high-temperature materials, guarantees excellent thermal and mechanical performance. With a compact 1mm pitch and vertical mount orientation, it optimizes PCB space and allows for efficient airflow. RoHS-compliant and suitable for PCI Express Gen IV buses, this connector is the ideal choice for high-speed data and device applications.






